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1. WO2018014562 - PIXEL ARRANGEMENT STRUCTURE, DISPLAY SUBSTRATE, DISPLAY APPARATUS AND METHOD OF FABRICATION THEREOF

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Publication Number WO/2018/014562
Publication Date 25.01.2018
International Application No. PCT/CN2017/075957
International Filing Date 08.03.2017
IPC
H01L 27/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
C23C 14/04 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
04Coating on selected surface areas, e.g. using masks
CPC
H01L 27/3211
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3206Multi-colour light emission
3211using RGB sub-pixels
H01L 27/3216
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3206Multi-colour light emission
3211using RGB sub-pixels
3216the areas of RGB sub-pixels being different
H01L 27/3218
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3206Multi-colour light emission
3211using RGB sub-pixels
3218characterised by the geometrical arrangement of the RGB sub-pixels
H01L 51/001
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
0002Deposition of organic semiconductor materials on a substrate
0008using physical deposition, e.g. sublimation, sputtering
001Vacuum deposition
H01L 51/0011
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
0002Deposition of organic semiconductor materials on a substrate
0008using physical deposition, e.g. sublimation, sputtering
0011selective deposition, e.g. using a mask
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants
  • BOE TECHNOLOGY GROUP CO., LTD. [CN]/[CN]
Inventors
  • JIN, Xiaodan
  • HUANGFU, Lujiang
  • LIANG, Yinan
Agents
  • TEE & HOWE INTELLECTUAL PROPERTY ATTORNEYS
Priority Data
201610585894.422.07.2016CN
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) PIXEL ARRANGEMENT STRUCTURE, DISPLAY SUBSTRATE, DISPLAY APPARATUS AND METHOD OF FABRICATION THEREOF
(FR) STRUCTURE D'AGENCEMENT DE PIXELS, SUBSTRAT D'AFFICHAGE, APPAREIL D'AFFICHAGE ET LEUR PROCÉDÉ DE FABRICATION
front page image
Abstract
(EN)
A pixel arrangement structure for a display device is provided. The pixel arrangement structure may comprise a first pixel (10A) and a second pixel (10B). The first pixel (10A) and the second pixel (10B) are alternately in a row direction and a column direction. The first pixel (10A) and the second pixel (10B) each comprise a first sub-pixel (11), a second sub-pixel (12) and a third sub-pixel (13). The first sub-pixel (11), the second sub-pixel (12) and the third sub-pixel (13) in the first pixel (10A) form a triangular distribution. The first sub-pixel (11), the second sub-pixel (12) and the third sub-pixel (13) in the second pixel (10B) form an inverted triangular distribution relative to the triangular distribution in the first pixel (10A). The second sub-pixel (12) and the third sub-pixel (13) in each of the first pixel (10A) and the second pixel (10B) are located on substantially the same row.
(FR)
L'invention concerne une structure d'agencement de pixels pour un dispositif d'affichage. La structure d'agencement de pixels peut comprendre un premier pixel (10A) et un second pixel (10B). Le premier pixel (10A) et le second pixel (10B) sont alternativement dans une direction de la rangée et dans une direction de la colonne. Le premier pixel (10A) et le second pixel (10B) comprennent chacun un premier sous-pixel (11), un deuxième sous-pixel (12) et un troisième sous-pixel (13). Le premier sous-pixel (11), le deuxième sous-pixel (12) et le troisième sous-pixel (13) dans le premier pixel (10A) forment une distribution triangulaire. Le premier sous-pixel (11), le deuxième sous-pixel (12) et le troisième sous-pixel (13) dans le second pixel (10B) forment une distribution triangulaire inversée par rapport à la distribution triangulaire dans le premier pixel (10A). Le deuxième sous-pixel (12) et le troisième sous-pixel (13) dans chacun du premier pixel (10A) et du deuxième pixel (10B) sont situés sensiblement sur la même rangée.
Also published as
CN107644888
EP3488469
IN201717038562
JP2019523432
KR1020180020943
US20180308907
Latest bibliographic data on file with the International Bureau
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