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1. (WO2018013573) COUPLING STRUCTURES FOR ELECTRONIC DEVICE HOUSINGS
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/013573    International Application No.:    PCT/US2017/041545
Publication Date: 18.01.2018 International Filing Date: 11.07.2017
IPC:
H04M 1/02 (2006.01), B29C 45/14 (2006.01), H01Q 1/24 (2006.01), H01Q 1/38 (2006.01), H04M 1/18 (2006.01), H05K 7/18 (2006.01)
Applicants: APPLE INC. [US/US]; One Infinite Loop Cupertino, California 95014 (US)
Inventors: GABLE, Brian M.; (US).
DI NALLO, Carlo; (US).
ELY, Colin M.; (US).
HORTON, Craig A.; (US).
DE JONG, Erik G.; (US).
ROTHKOPF, Fletcher R.; (US).
WETTERSTEN, Henry B.; (US).
LI, Hoishun; (US).
SAUERS, Jason C.; (US).
NATH, Jayesh; (US).
MARTINIS, Mario; (US).
PASCOLINI, Mattia; (US).
COLEMAN, Michael P.; (US).
EHMAN, Rex T.; (US).
WANG, Zheyu; (US)
Agent: HEMENWAY, S. Craig; (US).
ASARO, Elissa; (US).
ATKINSON, David S.; (US).
SCHULTE, Timothy R.; (US).
GUGGENHEIMER, Benno M.; (US).
NAGLE, Peter J.; (US).
DUFFY, Kevin J.; (US).
WAGNER, Stuart K.; (US).
JARVIS, Peter M.; (US).
TREECE, Randolph E.; (US).
JONAS, Tamala R.; (US).
ZELENKA, Richard E.; (US).
OSTERLOTH, Gregory W.; (US).
PRENDERGAST, Paul J.; (US).
CROWLEY-WEBER, Cara L.; (US).
WU, Rita; (US)
Priority Data:
15/212,029 15.07.2016 US
Title (EN) COUPLING STRUCTURES FOR ELECTRONIC DEVICE HOUSINGS
(FR) STRUCTURES DE COUPLAGE POUR BOÎTIERS DE DISPOSITIF ÉLECTRONIQUE
Abstract: front page image
(EN)A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
(FR)L'invention concerne un boîtier pour un dispositif électronique. Le boîtier comprend un premier composant conducteur définissant une première surface d'interface, un second composant conducteur définissant une seconde surface d'interface tournée vers la première surface d'interface, et une structure de joint entre les première et seconde surfaces d'interface. La structure de joint comprend un élément moulé formant une partie d'une surface extérieure du boîtier, et un élément d'étanchéité formant un joint étanche à l'eau entre les premier et second composants conducteurs. La présente invention concerne également des procédés de formation du boîtier de dispositif électronique.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)