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1. (WO2018013573) COUPLING STRUCTURES FOR ELECTRONIC DEVICE HOUSINGS

Pub. No.:    WO/2018/013573    International Application No.:    PCT/US2017/041545
Publication Date: Fri Jan 19 00:59:59 CET 2018 International Filing Date: Wed Jul 12 01:59:59 CEST 2017
IPC: H04M 1/02
B29C 45/14
H01Q 1/24
H01Q 1/38
H04M 1/18
H05K 7/18
Applicants: APPLE INC.
Inventors: GABLE, Brian M.
DI NALLO, Carlo
ELY, Colin M.
HORTON, Craig A.
DE JONG, Erik G.
ROTHKOPF, Fletcher R.
WETTERSTEN, Henry B.
LI, Hoishun
SAUERS, Jason C.
NATH, Jayesh
MARTINIS, Mario
PASCOLINI, Mattia
COLEMAN, Michael P.
EHMAN, Rex T.
WANG, Zheyu
Title: COUPLING STRUCTURES FOR ELECTRONIC DEVICE HOUSINGS
Abstract:
A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.