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1. (WO2018013553) IMPACT-ABSORBING MATERIAL AND ASSEMBLY COMPRISING THE SAME AND METHOD FOR THEIR MANUFACTURE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/013553 International Application No.: PCT/US2017/041517
Publication Date: 18.01.2018 International Filing Date: 11.07.2017
IPC:
C08L 83/04 (2006.01) ,C09D 183/04 (2006.01)
Applicants: ROGERS CORPORATION[US/US]; One Technology Drive Post Office Box 188 Rogers, Connecticut 06263-0188, US
Inventors: SOONG, Sharon; US
Agent: REIMER, Leah M.; US
Priority Data:
62/362,34314.07.2016US
Title (EN) IMPACT-ABSORBING MATERIAL AND ASSEMBLY COMPRISING THE SAME AND METHOD FOR THEIR MANUFACTURE
(FR) MATÉRIAU ABSORBANT LES CHOCS ET ENSEMBLE COMPRENANT CELUI-CI ET LEUR PROCÉDÉ DE FABRICATION
Abstract:
(EN) An impact-absorbing material that is capable of use for protecting an electronic device and that is formed from a miscible blend, in organic solvent, of a composition comprising more than 70 wt.% of a first component consisting of thermosetting silicone and less than 10 wt.% of a second component consisting of thermoplastic elastomeric block copolymer, wherein each weight percent is based on the total weight of Component A and Component B in the composition. Also disclosed is a method of manufacturing such impact-absorbing materials and an assembly that comprises the same in association with an electronic device.
(FR) La présente invention concerne un matériau absorbant les chocs qui est apte à être utilisé pour protéger un dispositif électronique et qui est formé à partir d'un mélange miscible, dans un solvant organique, d'une composition comprenant plus de 70 % en poids d'un premier constituant constitué de silicone thermodurcissable et moins de 10 % en poids d'un second constituant constitué d'un copolymère séquencé élastomère thermoplastique, chaque pourcentage en poids étant rapporté au poids total du constituant A et du constituant B dans la composition. L'invention concerne également un procédé de fabrication de tels matériaux absorbant les chocs et d'un ensemble qui les comprend en association avec un dispositif électronique.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)