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1. (WO2018013459) METHOD FOR REALIZING ULTRA-THIN SENSORS AND ELECTRONICS WITH ENHANCED FRAGILITY
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/013459    International Application No.:    PCT/US2017/041321
Publication Date: 18.01.2018 International Filing Date: 10.07.2017
IPC:
H01L 29/786 (2006.01), H01L 29/16 (2006.01), H01L 21/311 (2006.01)
Applicants: THE CHARLES STARK DRAPER LABORATORY, INC. [US/US]; 555 Technology Square Cambridge, MA 02139 (US)
Inventors: COOK, Eugene, H.; (US).
DUWEL, Amy; (US).
CARTER, David, J. D.; (US).
PERLIN, Gayatri, E.; (US)
Agent: LANDO, Peter, C.; (US).
GERSTENZANG, Gregory, K.; (US)
Priority Data:
15/207,185 11.07.2016 US
Title (EN) METHOD FOR REALIZING ULTRA-THIN SENSORS AND ELECTRONICS WITH ENHANCED FRAGILITY
(FR) PROCÉDÉ DE RÉALISATION DE CAPTEURS ULTRA-MINCES ET COMPOSANTS ÉLECTRONIQUES À FRAGILITÉ AMÉLIORÉE
Abstract: front page image
(EN)A method of fabricating ultra-thin semiconductor devices includes forming an array of semiconductor dielets mechanically suspended on a frame with at least one tether connecting each semiconductor dielet of the array of semiconductor dielets to the frame.
(FR)Un procédé de fabrication de dispositifs à semi-conducteurs ultra-minces consiste à former un réseau de puces "dielets" à semi-conducteurs suspendus mécaniquement sur un cadre, au moins une attache reliant chaque puce "dielet" à semi-conducteurs du réseau de puce"dielets" à semi-conducteurs au cadre.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)