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1. (WO2018013205) METHODS OF FORMING AN ELEVATIONALLY EXTENDING CONDUCTOR LATERALLY BETWEEN A PAIR OF CONDUCTIVE LINES

Pub. No.:    WO/2018/013205    International Application No.:    PCT/US2017/032134
Publication Date: Fri Jan 19 00:59:59 CET 2018 International Filing Date: Fri May 12 01:59:59 CEST 2017
IPC: H01L 27/108
Applicants: MICRON TECHNOLOGY, INC.
Inventors: YANG, Guangjun
BENSON, Russell A.
GILGEN, Brent
SCHRINSKY, Alex J.
TANG, Sanh, D.
LEE, Si-Woo
Title: METHODS OF FORMING AN ELEVATIONALLY EXTENDING CONDUCTOR LATERALLY BETWEEN A PAIR OF CONDUCTIVE LINES
Abstract:
A method of forming an elevationally extending conductor laterally between a pair of conductive lines comprises forming a pair of conductive lines spaced from one another in at least one vertical cross-section. Conductor material is formed to elevationally extend laterally between and cross elevationally over the pair of conductive lines in the at least one vertical cross-section. Sacrificial material is laterally between the elevationally extending conductor material and each of the conductive lines of the pair in the at least one vertical cross-section. The sacrificial material is removed from between the elevationally extending conductor material and each of the conductive lines of the pair while the conductor material is crossing elevationally over the pair of conductive lines to form a void space laterally between the elevationally extending conductor material and each of the conductive lines of the pair in the at least one vertical cross-section.