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1. (WO2018013121) SYSTEMS AND METHODS FOR SEMICONDUCTOR PACKAGES USING PHOTOIMAGEABLE LAYERS
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/013121 International Application No.: PCT/US2016/042285
Publication Date: 18.01.2018 International Filing Date: 14.07.2016
IPC:
H01L 23/00 (2006.01) ,H01L 23/12 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
Applicants: INTEL CORPORATION[US/US]; 2200 Mission College Boulevard Santa Clara, California 95054, US
Inventors: CHAVALI, Sri Chaitra; US
ALUR, Siddharth K.; US
SCHUCKMAN, Amanda E.; US
ALUR, Amruthavalli Pallavi; US
SALAMA, Islam A.; US
DENG, Yikang; US
DARMAWIKARTA, Kristof; US
Agent: GRIFFIN, III, Malvern U.; US
Priority Data:
Title (EN) SYSTEMS AND METHODS FOR SEMICONDUCTOR PACKAGES USING PHOTOIMAGEABLE LAYERS
(FR) SYSTÈMES ET PROCÉDÉS POUR BOÎTIERS À SEMI-CONDUCTEURS UTILISANT DES COUCHES PHOTO-IMAGEABLE
Abstract:
(EN) Various embodiments of the disclosure are directed to a semiconductor package and a method for fabrication of the semiconductor package. Further, disclosed herein are systems and methods that are directed to using a photoimageable dielectric (PID) layer with substantially similar mechanical properties as that of a mold material. The disclosure can be used, for example, in the context of bumpless laserless embedded substrate structures (BLESS) technology for wafer/panel level redistribution layer (RDL) and/or fan-out packaging applications. The disclosed embodiments may reduce the need for multiple dry resist film (DFR) lamination steps during various processing steps for semiconductor packaging and can also facilitate multiple layer counts due to the availability of thin PID materials.
(FR) Divers modes de réalisation de l'invention concernent un boîtier de semi-conducteur et un procédé de fabrication du boîtier de semi-conducteur. En outre, l'invention concerne des systèmes et des procédés qui concernent l'utilisation d'une couche diélectrique photo-imageable (PID) ayant des propriétés mécaniques sensiblement similaires à celles d'un matériau de moule. L'invention peut être utilisée, par exemple, dans le contexte de la technologie des structures de substrat intégrées sans bosses sans laser (BLESS) pour une couche de redistribution du niveau de la tranche/panneau (RDL) et/ou des applications de conditionnement en éventail. Les modes de réalisation décrits peuvent réduire le besoin de multiples étapes de stratification de film de résist sec (DFR) pendant diverses étapes de traitement pour le conditionnement de semi-conducteurs et peuvent également faciliter des comptes de couches multiples en raison de la disponibilité de matériaux PID minces.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)