Search International and National Patent Collections

1. (WO2018013114) MICROPLATE LID

Pub. No.:    WO/2018/013114    International Application No.:    PCT/US2016/042210
Publication Date: Fri Jan 19 00:59:59 CET 2018 International Filing Date: Fri Jul 15 01:59:59 CEST 2016
IPC: B01L 3/14
G01N 33/48
B81B 7/04
Applicants: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventors: DUDENHOEFER, Christie
NIELSEN, Jeffrey A.
WARD, Ken
SMITH, Matthew D.
ELY, Hilary
Title: MICROPLATE LID
Abstract:
A microplate lid is disclosed. An electronics board includes a plurality of board throughholes corresponding to well locations of a microplate. A cover plate includes a plurality of plate throughholes corresponding to respective board throughholes to define a plurality of plate-board throughhole pairs. The cover plate is located atop the electronics board. A plurality of directing lumens is at least partially defined by the cover plate. Each directing lumen corresponds to a respective plate throughhole. A plurality of user-perceptible array indicators is provided to the electronics board. Each array indicator is associated with a different plate-board throughhole pair than every other array indicator.