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1. (WO2018012378) COIL MODULE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/012378    International Application No.:    PCT/JP2017/024702
Publication Date: 18.01.2018 International Filing Date: 05.07.2017
H01F 38/14 (2006.01), H01F 17/00 (2006.01), H01F 27/29 (2006.01), H01F 37/00 (2006.01), H01L 23/12 (2006.01), H01L 25/00 (2006.01)
Applicants: MURATA MANUFACTURING CO., LTD. [JP/JP]; 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555 (JP)
Inventors: YONEMORI, Keito; (JP)
Agent: YOSHIKAWA, Shuichi; (JP).
SOBAJIMA, Masaaki; (JP)
Priority Data:
2016-140825 15.07.2016 JP
(JA) コイルモジュール
Abstract: front page image
(EN)A coil module (100) is provided with: a substrate (110) that has a coil antenna (111); and a resin member (120) that covers at least one main surface of the substrate, wherein the resin member (120) is provided with a booster coil (121) that is not directly connected to the coil antenna (111) but linked therewith via a magnetic field. The diameter of the booster coil (121) may be larger than the coil diameter of the coil antenna (111), the substrate (110) is a rigid substrate, and the resin member (120) may be a member that is more flexible than the substrate (110).
(FR)Un module de bobine (100) est pourvu : d'un substrat (110) qui a une antenne bobine (111); et d'un élément de résine (120) qui recouvre au moins une surface principale du substrat, l'élément de résine (120) est pourvue d'une bobine d'amplification (121) qui n'est pas directement connectée à l'antenne bobine (111) mais reliée à celle-ci par l'intermédiaire d'un champ magnétique. Le diamètre de la bobine d'amplification (121) peut être supérieur au diamètre de la bobine de l'antenne bobine (111), le substrat (110) est un substrat rigide, et l'élément de résine (120) peut être un élément qui est plus flexible que le substrat (110).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)