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1. (WO2018012314) SOLID-STATE IMAGING ELEMENT AND MANUFACTURING METHOD, AND ELECTRONIC DEVICE

Pub. No.:    WO/2018/012314    International Application No.:    PCT/JP2017/024102
Publication Date: Fri Jan 19 00:59:59 CET 2018 International Filing Date: Sat Jul 01 01:59:59 CEST 2017
IPC: H01L 27/146
G02B 3/00
H04N 5/369
Applicants: SONY CORPORATION
ソニー株式会社
Inventors: NISHIKIDO Kenju
西木戸 健樹
SHINOHARA Takekazu
篠原 武一
NOUDO Shinichiro
納土 晋一郎
KONDO Misato
近藤 美里
Title: SOLID-STATE IMAGING ELEMENT AND MANUFACTURING METHOD, AND ELECTRONIC DEVICE
Abstract:
The present disclosure relates to a solid-state imaging element and manufacturing method, and an electronic device, with which irregular reflection of light in a solid-state imaging element package can be suppressed. The solid-state imaging element comprises: a planar arrangement of a plurality of pixels; a connection portion which is disposed outside an imaging area for performing imaging by receiving entering light, and which is utilized for external connection; and an opening portion formed extending to the connection portion from a light entry surface side on which light enters with respect to the imaging area. A plurality of periodically arranged convex portions are formed on a countersunk surface which is a surface other than the connection portion in the opening portion, and which comprises a surface facing at least the light entry surface side at a position lower than the imaging area or a layer provided in a peripheral area of the imaging area and including organic matter. The present technology may be applied in a backside illuminated type or laminated type CMOS image sensor.