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1. (WO2018012313) WIRE SAW DEVICE AND METHOD FOR CUTTING WORKPIECE

Pub. No.:    WO/2018/012313    International Application No.:    PCT/JP2017/024063
Publication Date: Fri Jan 19 00:59:59 CET 2018 International Filing Date: Sat Jul 01 01:59:59 CEST 2017
IPC: B24B 27/06
B24B 49/10
B28D 5/04
H01L 21/304
Applicants: SHIN-ETSU HANDOTAI CO.,LTD.
信越半導体株式会社
Inventors: USAMI Yoshihiro
宇佐美 佳宏
Title: WIRE SAW DEVICE AND METHOD FOR CUTTING WORKPIECE
Abstract:
The present invention is a wire saw device that includes: a wire feed reel that lets out wire; wire rows formed of the wire spirally wound around a plurality of wire guides; a wire winding reel on which the wire is wound; and a workpiece holding part that holds a workpiece to be cut, wherein the wire saw device performs cutting by pressing the workpiece held by the workpiece holding part against the wire rows travelling while repeating advancing and retracting at least once. The wire saw device is characterized by having a vibration sensor that is attached to the workpiece holding part and a load cell that detects the tension of the wire. This provides a wire saw device and a method for cutting a workpiece with which it is possible to determine, before cutting the workpiece, a condition in which violent movement of the wire due to tension is occurring or in which an abnormal vibration of the wire saw device is occurring and with which it is possible to prevent degradation of the quality of wafers cut out from the workpiece.