Search International and National Patent Collections

1. (WO2018012214) SEMICONDUCTOR SENSOR CHIP, SEMICONDUCTOR SENSOR CHIP ARRAY, AND ULTRASONIC DIAGNOSTIC EQUIPMENT

Pub. No.:    WO/2018/012214    International Application No.:    PCT/JP2017/022614
Publication Date: Fri Jan 19 00:59:59 CET 2018 International Filing Date: Wed Jun 21 01:59:59 CEST 2017
IPC: A61B 8/00
H01L 27/04
H04R 1/06
Applicants: HITACHI, LTD.
株式会社日立製作所
Inventors: YOSHIMURA Yasuhiro
吉村 保廣
SAKO Akifumi
佐光 暁史
YAMASHITA Naoaki
山下 尚昭
NAGATA Tatsuya
永田 達也
Title: SEMICONDUCTOR SENSOR CHIP, SEMICONDUCTOR SENSOR CHIP ARRAY, AND ULTRASONIC DIAGNOSTIC EQUIPMENT
Abstract:
The present invention addresses the problem of enlarging a sensing area in an ultrasonic probe so as to achieve a higher definition. This ultrasonic diagnostic equipment is provided with an ultrasonic probe that comprises: a CMUT chip (2a) that has drive electrodes (3e)-(3j), etc., arranged in a grid-like configuration on a rectangular CMUT element section (21); and a CMUT chip (2b) that has drive electrodes (3p)-(3u), etc., arranged in a grid-like configuration on the rectangular CMUT element section (21), that is adjacent to the CMUT chip (2a), and in which the drive electrodes (3e)-(3j) of the adjacent CMUT chip (2a) are electrically connected to the respective drive electrodes (3p)-(3u) via bonding wires (4f)-(4i), etc.