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1. (WO2018012097) DUAL-SURFACE POLISHING DEVICE
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Pub. No.: WO/2018/012097 International Application No.: PCT/JP2017/017855
Publication Date: 18.01.2018 International Filing Date: 11.05.2017
IPC:
B24B 37/12 (2012.01) ,B24B 37/08 (2012.01) ,H01L 21/304 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37
Lapping machines or devices; Accessories
11
Lapping tools
12
Lapping plates for working plane surfaces
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37
Lapping machines or devices; Accessories
04
designed for working plane surfaces
07
characterised by the movement of the work or lapping tool
08
for double side lapping
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
Applicants:
株式会社SUMCO SUMCO CORPORATION [JP/JP]; 東京都港区芝浦一丁目2番1号 2-1, Shibaura 1-chome, Minato-ku, Tokyo 1058634, JP
Inventors:
江▲崎▼ 圭佑 ESAKI, Keisuke; JP
Agent:
須田 正義 SUDA, Masayoshi; JP
Priority Data:
2016-13846413.07.2016JP
Title (EN) DUAL-SURFACE POLISHING DEVICE
(FR) DISPOSITIF POUR POLISSAGE DOUBLE FACE
(JA) 両面研磨装置
Abstract:
(EN) An inner periphery-side cutoff part (X1), in which the polishing surface of an upper plate (12) inclines upwards towards the inner periphery part of the upper plate (12), and an inner periphery-side cutoff part (Y1), in which the polishing surface of a lower plate inclines downwards towards the inner periphery part of the lower plate, are formed on the inner periphery part of the upper plate (12) and of the lower plate (13), respectively; and/or an outer periphery-side cutoff part (X2), in which the polishing surface of the upper plate (12) inclines upwards towards the outer periphery part of the upper plate (12), and an outer periphery-side cutoff part (Y2), in which the polishing surface of the lower plate inclines downwards towards the outer periphery part of the lower plate, are formed on the outer periphery part of the upper plate (12) and of the lower plate (13), respectively.
(FR) L'invention concerne un dispositif pour polissage double face sur lequel une partie de coupe côté périphérique intérieur (X1), dans laquelle la surface de polissage d'une plaque supérieure (12) s'incline vers le haut en direction de la partie périphérique intérieure de la plaque supérieure (12), et une partie de coupe côté périphérique intérieur (Y1), dans laquelle la surface de polissage d'une plaque inférieure s'incline vers le bas en direction de la partie périphérique intérieure de la plaque inférieure, sont respectivement formées sur la partie périphérique intérieure de la plaque supérieure (12) et de la plaque inférieure (13); et/ou une partie de coupe côté périphérique extérieur (X2), dans laquelle la surface de polissage de la plaque supérieure (12) s'incline vers le haut en direction de la partie périphérique extérieure de la plaque supérieure (12), et une partie de coupe côté périphérique extérieure (Y2), dans laquelle la surface de polissage de la plaque inférieure s'incline vers le bas en direction de la partie périphérique extérieure de la plaque inférieure, sont respectivement formées sur la partie périphérique extérieure de la plaque supérieure (12) et de la plaque inférieure (13).
(JA) 上定盤(12)と下定盤(13)の各内周部に、上定盤(12)の内周部に向かって上定盤(12)の研磨面が上方へ傾斜する内周側切落し部(X1)と下定盤の内周部に向かって下定盤の研磨面が下方へ傾斜する内周側切落し部(Y1)がそれぞれ形成されるか、上定盤(12)と下定盤(13)の各外周部に、上定盤(12)の外周部に向かって上定盤(12)の研磨面が上方へ傾斜する外周側切落し部(X2)と下定盤の外周部に向かって下定盤の研磨面が下方へ傾斜する外周側切落し部(Y2)がそれぞれ形成されるか、或いはこれらの全てが形成される。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)