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1. (WO2018009711) TRANSPORT PATH CORRECTION TECHNIQUES AND RELATED SYSTEMS, METHODS AND DEVICES
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2018/009711 International Application No.: PCT/US2017/040968
Publication Date: 11.01.2018 International Filing Date: 06.07.2017
IPC:
H01L 21/67 (2006.01) ,H01L 21/68 (2006.01) ,H01L 23/02 (2006.01) ,H01L 23/28 (2006.01) ,H01L 51/56 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
68
for positioning, orientation or alignment
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56
Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants:
KATEEVA, INC. [US/US]; 7015 Gateway Boulevard Newark, California 94560, US
Inventors:
PUN, Digby; US
DARROW, David C.; US
LOWRANCE, Robert B.; US
KO, Alexander Sou-Kang; US
Agent:
HARPER, Burch; US
SCHUYLER, Marc; US
Priority Data:
15/642,03705.07.2017US
62/359,96908.07.2016US
62/459,40215.02.2017US
62/489,76825.04.2017US
Title (EN) TRANSPORT PATH CORRECTION TECHNIQUES AND RELATED SYSTEMS, METHODS AND DEVICES
(FR) TECHNIQUES DE CORRECTION DE TRAJECTOIRE DE TRANSPORT ET SYSTÈMES, PROCÉDÉS ET DISPOSITIFS ASSOCIÉS
Abstract:
(EN) A printer deposits material onto a substrate as part of a manufacturing process for an electronic product. At least one mechanical component experiences mechanical error, which is mitigated using transducers that equalize position of a transported thing, e.g., to provide an "ideal" conveyance path; a substrate conveyance system and/or a printhead conveyance system can each use transducers in this manner to improve precise droplet placement. In one embodiment, errors are measured in advance, with corrections being "played back" during production runs to mitigate repeatable transport path error. In a still more detailed embodiment, the transducers can be predicated on voice coils, which cooperate with a floatation table and floating, mechanical pivot assembly to provide frictionless, but mechanically-supported error correction.
(FR) Selon l'invention, une imprimante dépose un matériau sur un substrat dans le cadre d'un processus de fabrication de produit électronique. Au moins un composant mécanique subit une erreur mécanique qui est atténuée au moyen de transducteurs qui équilibrent la position d'un objet transporté, par exemple pour fournir une trajectoire de transport idéale ; un système de transport de substrat et/ou un système de transport de tête d'impression peuvent chacun mettre en oeuvre des transducteurs de cette manière afin d'améliorer le placement précis des gouttelettes. Dans un mode de réalisation, les erreurs sont mesurées à l'avance, des corrections étant "lues" pendant les cycles de production afin d'atténuer une erreur de trajectoire de transport susceptible de se répéter. Dans un mode de réalisation encore plus détaillé, les transducteurs peuvent être basés sur des bobines acoustiques qui coopèrent avec une table de flottaison et un ensemble pivot mécanique flottant pour assurer une correction d'erreur sans frottement, mais supportée mécaniquement.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
KR1020190017054CN109417043EP3482413