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1. (WO2018009543) MOLDED INTERCONNECT DEVICE AND METHOD OF MAKING SAME

Pub. No.:    WO/2018/009543    International Application No.:    PCT/US2017/040721
Publication Date: Fri Jan 12 00:59:59 CET 2018 International Filing Date: Thu Jul 06 01:59:59 CEST 2017
IPC: H05K 3/10
H05K 3/04
Applicants: MOLEX, LLC
Inventors: CHANG, Tsuey Choo
ZEILINGER, Steven
KO, Hyun-Jong
RILEY, Patrick
KANG, SukMin
Title: MOLDED INTERCONNECT DEVICE AND METHOD OF MAKING SAME
Abstract:
In some embodiments, a manufacturing process includes injection molding a palladium-catalyzed material into a substrate, forming a thin copper film over exterior and exposed surfaces of the substrate; ablating or removing copper film from the substrate to provide first, second and optional third portions of the copper film and ablated sections; electrolytically plating each portion to form metallic-plated portions; and ablating or removing the second portion in order to isolate the first portion. The metallic-plated first portion comprises a circuit portion of a molded interconnect device (MID), and where the metallic-plated third portion comprises a Faraday cage portion of a MID. A soft etching step may be included. A solder resist application step can be added, along with an associated solder resist removal step.