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Machine translation
1. (WO2018009150) A METHOD OF FABRICATING AN ELECTRICAL CIRCUIT ASSEMBLY ON A FLEXIBLE SUBSTRATE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/009150    International Application No.:    PCT/SG2017/050347
Publication Date: 11.01.2018 International Filing Date: 07.07.2017
IPC:
H05K 1/14 (2006.01), H05K 1/02 (2006.01)
Applicants: NANYANG TECHNOLOGICAL UNIVERSITY [SG/SG]; 50 Nanyang Avenue, Singapore 639798 (SG)
Inventors: CHANG, Joseph; (SG).
GE, Tong; (SG).
LIN, Tong; (SG).
ZHOU, Jia; (SG)
Agent: POH, Chee Kian, Daniel; (SG)
Priority Data:
10201605592Q 08.07.2016 SG
Title (EN) A METHOD OF FABRICATING AN ELECTRICAL CIRCUIT ASSEMBLY ON A FLEXIBLE SUBSTRATE
(FR) PROCÉDÉ DE FABRICATION D'UN ENSEMBLE CIRCUIT ÉLECTRIQUE SUR UN SUBSTRAT FLEXIBLE
Abstract: front page image
(EN)A Method of Fabricating an Electrical Circuit Assembly on a Flexible Substrate A method of fabricating an electrical circuit assembly on a flexible substrate is disclosed. The method comprises: identifying one or more bending-sensitive elements of an electrical circuit assembly, each bending-sensitive element having a performance that varies when said bending-sensitive element is flexed; splitting said one or more bending-sensitive elements into a first portion and a second portion, wherein the first portion and the second portion are functionally equivalent and together equate to said bending-sensitive element; printing the first portion of said bending-sensitive element on a first surface of the flexible substrate; printing the second portion of said bending-sensitive element on a second surface of the flexible substrate, diametrically opposite the first portion such that bending of the flexible substrate has an opposite effect on each of the first and second portions thereby serving to substantially cancel the effect on each portion out; and electrically connecting the first portion and the second portion.
(FR)L'invention porte sur un procédé de fabrication d'un ensemble de circuit électrique sur un substrat flexible. Le procédé consiste à : identifier un ou plusieurs éléments sensibles à la flexion d'un ensemble de circuit électrique, chaque élément sensible à la flexion ayant une performance qui varie lorsque ledit élément sensible à la flexion est fléchi; diviser ledit ou lesdits éléments sensibles à la flexion en une première partie et en une seconde partie, la première partie et la seconde partie étant fonctionnellement équivalentes et réunies ensemble audit élément sensible à la flexion; imprimer la première partie dudit élément sensible à la flexion sur une première surface du substrat souple; imprimer la seconde partie dudit élément sensible à la flexion sur une seconde surface du substrat souple, diamétralement opposée à la première partie de sorte que la flexion du substrat flexible ait un effet opposé sur chacune des première et seconde parties, ce qui permet d'annuler sensiblement l'effet sur chaque partie; et connecter électriquement la première partie et la seconde partie.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)