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1. (WO2018008745) ETCHING LIQUID COMPOSITION AND ETCHING METHOD

Pub. No.:    WO/2018/008745    International Application No.:    PCT/JP2017/024971
Publication Date: Fri Jan 12 00:59:59 CET 2018 International Filing Date: Sat Jul 08 01:59:59 CEST 2017
IPC: H01L 21/308
C23F 1/26
H01L 21/3213
H01L 21/768
Applicants: KANTO KAGAKU KABUSHIKI KAISHA
関東化學株式会社
Inventors: KOUNO, Ryou
河野 良
OHWADA, Takuo
大和田 拓央
Title: ETCHING LIQUID COMPOSITION AND ETCHING METHOD
Abstract:
Provided are: an etching liquid composition which is capable of collectively etching a tungsten film and a titanium nitride film; and an etching method which uses this etching liquid composition. An etching liquid composition according to the present invention contains nitric acid and water, and is used for the purpose of collectively etching a tungsten film and a titanium nitride film.