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1. (WO2018008745) ETCHING LIQUID COMPOSITION AND ETCHING METHOD
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/008745    International Application No.:    PCT/JP2017/024971
Publication Date: 11.01.2018 International Filing Date: 07.07.2017
IPC:
H01L 21/308 (2006.01), C23F 1/26 (2006.01), H01L 21/3213 (2006.01), H01L 21/768 (2006.01)
Applicants: KANTO KAGAKU KABUSHIKI KAISHA [JP/JP]; 2-8, Nihonbashihoncho 3-chome, Chuo-ku, Tokyo 1030023 (JP)
Inventors: KOUNO, Ryou; (JP).
OHWADA, Takuo; (JP)
Agent: KUZUWA, Kiyoshi; (JP)
Priority Data:
2016-136336 08.07.2016 JP
Title (EN) ETCHING LIQUID COMPOSITION AND ETCHING METHOD
(FR) COMPOSITION LIQUIDE DE GRAVURE ET PROCÉDÉ DE GRAVURE
(JA) エッチング液組成物およびエッチング方法
Abstract: front page image
(EN)Provided are: an etching liquid composition which is capable of collectively etching a tungsten film and a titanium nitride film; and an etching method which uses this etching liquid composition. An etching liquid composition according to the present invention contains nitric acid and water, and is used for the purpose of collectively etching a tungsten film and a titanium nitride film.
(FR)L'invention concerne : une composition liquide de gravure qui est capable de graver collectivement un film de tungstène et un film de nitrure de titane ; et un procédé de gravure qui utilise cette composition liquide de gravure. Une composition liquide de gravure selon la présente invention contient de l'acide nitrique et de l'eau, et est utilisée dans le but de graver collectivement un film de tungstène et un film de nitrure de titane.
(JA)タングステン膜と窒化チタン膜とを一括でエッチング処理することが可能なエッチング液組成物および当該エッチング液組成物を用いたエッチング方法を提供する。 本発明のエッチング組成物は、硝酸と、水とを含む、タングステン膜と窒化チタン膜とを一括でエッチング処理するためのエッチング液組成物である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)