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1. (WO2018008614) IMAGING ELEMENT, METHOD FOR PRODUCING IMAGING ELEMENT, AND ELECTRONIC DEVICE

Pub. No.:    WO/2018/008614    International Application No.:    PCT/JP2017/024414
Publication Date: Fri Jan 12 00:59:59 CET 2018 International Filing Date: Wed Jul 05 01:59:59 CEST 2017
IPC: H01L 27/146
H04N 5/374
Applicants: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
ソニーセミコンダクタソリューションズ株式会社
Inventors: SATO Naoyuki
佐藤 尚之
OHTSU Eriko
大津 枝理子
Title: IMAGING ELEMENT, METHOD FOR PRODUCING IMAGING ELEMENT, AND ELECTRONIC DEVICE
Abstract:
This disclosure relates to: a backside-illuminated imaging element which is able to be suppressed in light incidence on an charge retention part; a method for producing an imaging element; and an electronic device. This imaging element is provided with: a photoelectric conversion part; a charge retention part; a semiconductor substrate; a wiring layer; an insulating film layer; a first light-blocking film; and a second light-blocking film. On a second surface of the semiconductor substrate, said second surface being on the reverse side of a first surface on which light is incident, the insulating film layer, the first light-blocking film and the wiring layer are laminated in this order from the second surface side. The second light-blocking film is provided with: a first light-blocking part which is arranged between the photoelectric conversion part and the charge retention part and extends from the first surface of the semiconductor substrate to a partway position within the semiconductor substrate; a second light-blocking part which is arranged between the photoelectric conversion part and the charge retention part and penetrates through the semiconductor substrate; and a third light-blocking part which covers a part of the first surface of the semiconductor substrate. This technique is applicable, for example, to a CMOS image sensor.