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1. (WO2018008440) HEAT FLUX SENSOR MODULE AND MANUFACTURING METHOD THEREFOR

Pub. No.:    WO/2018/008440    International Application No.:    PCT/JP2017/023352
Publication Date: Fri Jan 12 00:59:59 CET 2018 International Filing Date: Tue Jun 27 01:59:59 CEST 2017
IPC: G01K 17/20
G01K 7/02
Applicants: DENSO CORPORATION
株式会社デンソー
Inventors: HARADA, Toshikazu
原田 敏一
SAKAIDA, Atusi
坂井田 敦資
TANIGUCHI, Toshihisa
谷口 敏尚
GOUKO, Norio
郷古 倫央
OKAMOTO, Keiji
岡本 圭司
Title: HEAT FLUX SENSOR MODULE AND MANUFACTURING METHOD THEREFOR
Abstract:
A heat flux sensor module 2 is provided with: a first film 20 having a surface 21; multiple sensor chips 10 which are disposed on the surface 21 so as to be spaced from one another and which each detect heat flux; a second film 30 stacked on the surface 21 side of the first film 20 such that the multiple sensor chips 10 are sandwiched between the first film 20 and the second film 30; and heat conduction members 40 which are disposed between the adjacent sensor chips 10 and each of which has heat conductivity higher than that of air. The heat conduction members 40 are in contact with both the first film 20 and the second film 30.