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1. (WO2018008416) ACTIVE ESTER COMPOSITION AND CURED PRODUCT THEREOF
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Pub. No.: WO/2018/008416 International Application No.: PCT/JP2017/023002
Publication Date: 11.01.2018 International Filing Date: 22.06.2017
IPC:
C08G 59/02 (2006.01) ,H01L 23/29 (2006.01) ,H01L 23/31 (2006.01) ,H05K 1/03 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
02
Polycondensates containing more than one epoxy group per molecule
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants: DIC CORPORATION[JP/JP]; 35-58, Sakashita 3-chome, Itabashi-ku, Tokyo 1748520, JP
Inventors: SATOU Yutaka; JP
KAWASAKI Akito; JP
OKAMOTO Tatsuya; JP
YAMOTO Kazuhisa; JP
Agent: KONO Michihiro; JP
Priority Data:
2016-13422706.07.2016JP
2016-14041915.07.2016JP
2016-14042015.07.2016JP
2016-14042115.07.2016JP
2016-14042215.07.2016JP
2016-15653609.08.2016JP
2016-15767010.08.2016JP
Title (EN) ACTIVE ESTER COMPOSITION AND CURED PRODUCT THEREOF
(FR) COMPOSITION D’ESTER ACTIF, ET PRODUIT DURCI DE CELLE-CI
(JA) 活性エステル組成物及びその硬化物
Abstract:
(EN) Provided are: an active ester composition having high curability and excellent performance such as low dielectric properties, etc., in a cured product; a cured product thereof; a semiconductor sealing material using said active ester composition; and a printed wiring board. An active ester composition characterized by having, as required components thereof, (A) an active ester compound being an ester compound of (a1) a compound having one phenolic hydroxyl group in the molecular structure thereof and (a2) an aromatic polycarboxylic acid or an acid halide thereof and (B) a phenolic hydroxyl group-containing compound; a cured product thereof; a semiconductor sealing material using said active ester composition; and a printed wiring board.
(FR) L’invention fournit une composition d’ester actif présentant des propriétés élevées de durcissement, et se révélant excellente dans diverses performances telles que ses faibles propriétés diélectriques dans un produit durci. L’invention fournit également un produit durci associé, et un matériau de scellement de semi-conducteur ainsi qu’une carte de circuit imprimé mettant en œuvre ladite composition d’ester actif. La composition d’ester actif de l’invention est caractéristique en ce que ses composants essentiels sont : un composé ester actif (A) qui consiste en un produit estérifié d’un composé (a1) possédant un groupe hydroxy phénolique dans sa structure moléculaire, et d’un acide polycarboxylique aromatique ou d’un halogénure d’acide de celui-ci (a2) ; et un composé à teneur en groupe hydroxy phénolique (B). L’invention concerne également un produit durci associé, et un matériau de scellement de semi-conducteur ainsi qu’une carte de circuit imprimé mettant en œuvre ladite composition d’ester actif.
(JA) 硬化性が高く、かつ、硬化物における低誘電性等の諸性能に優れる活性エステル組成物、その硬化物、前記活性エステル組成物を用いてなる半導体封止材料及びプリント配線基板を提供すること。分子構造中にフェノール性水酸基を一つ有する化合物(a1)と芳香族ポリカルボン酸又はその酸ハロゲン化物(a2)とのエステル化物である活性エステル化合物(A)と、フェノール性水酸基含有化合物(B)とを必須の成分とすることを特徴とする活性エステル組成物、その硬化物、前記活性エステル組成物を用いてなる半導体封止材料及びプリント配線基板。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)