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1. (WO2018008362) CIRCUIT BOARD AND ELECTRICAL JUNCTION BOX
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/008362    International Application No.:    PCT/JP2017/022290
Publication Date: 11.01.2018 International Filing Date: 16.06.2017
Chapter 2 Demand Filed:    26.09.2017    
IPC:
H05K 7/06 (2006.01), H02G 3/16 (2006.01), H05K 1/02 (2006.01), H05K 3/20 (2006.01)
Applicants: AUTONETWORKS TECHNOLOGIES, LTD. [JP/JP]; 1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie 5108503 (JP).
SUMITOMO WIRING SYSTEMS, LTD. [JP/JP]; 1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie 5108503 (JP).
SUMITOMO ELECTRIC INDUSTRIES, LTD. [JP/JP]; 5-33, Kitahama 4-chome, Chuo-ku, Osaka-shi, Osaka 5410041 (JP)
Inventors: KITA Yukinori; (JP)
Agent: AKATSUKI UNION PATENT FIRM; 5th Floor, Nittochi Nagoya Bldg., 1-1, Sakae 2-chome, Naka-ku, Nagoya-shi, Aichi 4600008 (JP)
Priority Data:
2016-134791 07.07.2016 JP
Title (EN) CIRCUIT BOARD AND ELECTRICAL JUNCTION BOX
(FR) CARTE DE CIRCUIT IMPRIMÉ ET BOÎTE DE CONNEXION ÉLECTRIQUE
(JA) 回路基板及び電気接続箱
Abstract: front page image
(EN)A circuit board 20 is provided with: a bus bar 28; a first prepreg 31 overlapping the bus bar 28; and a sheet-like leakage preventing section 33, which overlaps the surface of the first prepreg 31, and suppresses leakage of the first prepreg 31 to the outside.
(FR)L'invention concerne une carte de circuit imprimé (20) comportant : une barre omnibus (28); un premier préimprégné (31) chevauchant la barre omnibus (28); et une section (33) de prévention des fuites de type feuille, qui chevauche la surface du premier préimprégné (31), et supprime la fuite du premier préimprégné (31) vers l'extérieur.
(JA)回路基板20は、バスバー28と、バスバー28に重ねられる第1プリプレグ31と、第1プリプレグ31の面に重ねられ、第1プリプレグ31の外部への漏れを抑制するシート状の漏れ止め部33と、を備える。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)