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1. (WO2018008362) CIRCUIT BOARD AND ELECTRICAL JUNCTION BOX
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Pub. No.: WO/2018/008362 International Application No.: PCT/JP2017/022290
Publication Date: 11.01.2018 International Filing Date: 16.06.2017
Chapter 2 Demand Filed: 26.09.2017
IPC:
H05K 7/06 (2006.01) ,H02G 3/16 (2006.01) ,H05K 1/02 (2006.01) ,H05K 3/20 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
02
Arrangements of circuit components or wiring on supporting structure
06
on insulating boards
H ELECTRICITY
02
GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
G
INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
3
Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
02
Details
08
Distribution boxes; Connection or junction boxes
16
structurally associated with support for line-connecting terminals within the box
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
20
by affixing prefabricated conductor pattern
Applicants: AUTONETWORKS TECHNOLOGIES, LTD.[JP/JP]; 1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie 5108503, JP
SUMITOMO WIRING SYSTEMS, LTD.[JP/JP]; 1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie 5108503, JP
SUMITOMO ELECTRIC INDUSTRIES, LTD.[JP/JP]; 5-33, Kitahama 4-chome, Chuo-ku, Osaka-shi, Osaka 5410041, JP
Inventors: KITA Yukinori; JP
Agent: AKATSUKI UNION PATENT FIRM; 5th Floor, Nittochi Nagoya Bldg., 1-1, Sakae 2-chome, Naka-ku, Nagoya-shi, Aichi 4600008, JP
Priority Data:
2016-13479107.07.2016JP
Title (EN) CIRCUIT BOARD AND ELECTRICAL JUNCTION BOX
(FR) CARTE DE CIRCUIT IMPRIMÉ ET BOÎTE DE CONNEXION ÉLECTRIQUE
(JA) 回路基板及び電気接続箱
Abstract:
(EN) A circuit board 20 is provided with: a bus bar 28; a first prepreg 31 overlapping the bus bar 28; and a sheet-like leakage preventing section 33, which overlaps the surface of the first prepreg 31, and suppresses leakage of the first prepreg 31 to the outside.
(FR) L'invention concerne une carte de circuit imprimé (20) comportant : une barre omnibus (28); un premier préimprégné (31) chevauchant la barre omnibus (28); et une section (33) de prévention des fuites de type feuille, qui chevauche la surface du premier préimprégné (31), et supprime la fuite du premier préimprégné (31) vers l'extérieur.
(JA) 回路基板20は、バスバー28と、バスバー28に重ねられる第1プリプレグ31と、第1プリプレグ31の面に重ねられ、第1プリプレグ31の外部への漏れを抑制するシート状の漏れ止め部33と、を備える。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)