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1. WO2018008257 - SEALING MATERIAL COMPOSITION AND SEALING MATERIAL

Publication Number WO/2018/008257
Publication Date 11.01.2018
International Application No. PCT/JP2017/018122
International Filing Date 12.05.2017
IPC
C08L 63/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C08F 2/44 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
2Processes of polymerisation
44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
C08L 25/04 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
25Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
02Homopolymers or copolymers of hydrocarbons
04Homopolymers or copolymers of styrene
H01L 23/29 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
29characterised by the material
H01L 23/31 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
H05K 3/28 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
CPC
C08F 2/46
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
2Processes of polymerisation
46Polymerisation initiated by wave energy or particle radiation
C08F 2/48
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
2Processes of polymerisation
46Polymerisation initiated by wave energy or particle radiation
48by ultra-violet or visible light
C08F 20/20
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
20Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
02Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
10Esters
20of polyhydric alcohols or ; polyhydric; phenols ; , e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
C08F 220/18
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
220Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
10Esters
12of monohydric alcohols or phenols
16of phenols or of alcohols containing two or more carbon atoms
18with acrylic or methacrylic acids
C08F 283/10
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
283Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
10on to polymers containing more than one epoxy radical per molecule
C08F 287/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
287Macromolecular compounds obtained by polymerising monomers on to block polymers
Applicants
  • 積水ポリマテック株式会社 SEKISUI POLYMATECH CO., LTD. [JP]/[JP]
Inventors
  • 愛澤 眸 AIZAWA Hitomi
Agents
  • 大竹 正悟 OHTAKE Seigo
Priority Data
2016-13370805.07.2016JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SEALING MATERIAL COMPOSITION AND SEALING MATERIAL
(FR) COMPOSITION DE MATÉRIAU D'ÉTANCHÉITÉ ET MATÉRIAU D'ÉTANCHÉITÉ
(JA) 封止材組成物および封止材
Abstract
(EN)
To provide a sealing material for affixing to an electronic element provided to an electronic substrate or the like or a portion where metal is exposed and protecting the electronic element or other adherend from moisture and the like, and an uncured sealing material composition for the same, the sealing material and the sealing material composition having fixed-shape properties, flexibility, and adhesive properties. The present invention is a sealing material composition having as essential components an epoxy resin cured material having a flexible skeleton, a monofunctional (meth)acrylate ester monomer, a photoradical polymerization initiator, and a styrene-based elastomer, the monofunctional (meth)acrylate ester monomer being curable by photoirradiation, and the sealing material composition having fixed-shape properties and flexibility whereby the load is 0.19-3.2 N when a 1-mm thickness thereof is 25% compressed by a columnar probe in which the distal end thereof forms a bottom surface having a diameter of 10 mm. The present invention is also a sealing material obtained by photocuring the sealing material composition.
(FR)
L'invention porte sur un matériau d'étanchéité destiné à être fixé à un élément électronique disposé sur un substrat électronique ou analogue ou à une partie où le métal est apparent et protégeant l'élément électronique ou un autre support contre l'humidité et analogue et une composition de matériau d'étanchéité non durcie correspondante, le matériau d'étanchéité et la composition de matériau d'étanchéité présentant des propriétés de forme fixe, une flexibilité et des propriétés adhésives. La présente invention est une composition de matériau d'étanchéité présentant comme constituants essentiels un matériau durci de résine époxy présentant un squelette souple, un monomère monofonctionnel d'ester de (méth)acrylate, un initiateur de polymérisation photoradicalaire et un élastomère à base de styrène, le monomère monofonctionnel d'ester de (méth)acrylate étant durcissable par photo-irradiation et la composition de matériau d'étanchéité présentant des propriétés de forme fixe et une flexibilité, la charge étant de 0,19-3,2 N lorsqu'une épaisseur de 1 mm correspondante est comprimée de 25 % par une sonde en forme de colonne dont l'extrémité distale correspondante forme une surface inférieure d'un diamètre de 10 mm. La présente invention concerne également un matériau d'étanchéité obtenu par photodurcissement de la composition de matériau d'étanchéité.
(JA)
電子基板等に設けた電子素子や、金属が露出した部分に貼付して電子素子などの被着物を水分などから保護する封止材およびその硬化前の封止材組成物について、定形性と柔軟性、そして接着性のあるものを提供すること。 柔軟骨格を有するエポキシ樹脂硬化物と、単官能(メタ)アクリル酸エステルモノマーと、光ラジカル重合開始剤と、スチレン系エラストマと、を必須成分としており、光照射によって単官能(メタ)アクリル酸エステルモノマーの硬化が可能であり、定形性を有するとともに、1mm厚を先端が直径10mmの底面となる円柱状のプローブで25%圧縮したときの荷重が0.19~3.2Nである柔軟性を有する封止材組成物とした。また、これを光硬化させた封止材とした。
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