Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2018008214) WIRING BOARD, METHOD FOR MANUFACTURING WIRING BOARD, ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2018/008214 International Application No.: PCT/JP2017/014101
Publication Date: 11.01.2018 International Filing Date: 04.04.2017
IPC:
H01L 23/12 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
Applicants:
TOWA株式会社 TOWA CORPORATION [JP/JP]; 京都府京都市南区上鳥羽上調子町5番地 5, Kamitoba Kamichoshi-cho, Minami-ku, Kyoto-shi, Kyoto 6018105, JP
Inventors:
黄 善夏 HWANG, Sun Ha; JP
Agent:
特許業務法人深見特許事務所 FUKAMI PATENT OFFICE, P.C.; 大阪府大阪市北区中之島三丁目2番4号 中之島フェスティバルタワー・ウエスト Nakanoshima Festival Tower West, 2-4, Nakanoshima 3-chome, Kita-ku, Osaka-shi, Osaka 5300005, JP
Priority Data:
2016-13603708.07.2016JP
Title (EN) WIRING BOARD, METHOD FOR MANUFACTURING WIRING BOARD, ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
(FR) CARTE DE CÂBLAGE, PROCÉDÉ DE FABRICATION DE CARTE DE CÂBLAGE, COMPOSANT ÉLECTRONIQUE ET PROCÉDÉ DE FABRICATION DE COMPOSANT ÉLECTRONIQUE
(JA) 配線基板、配線基板の製造方法、電子部品、および電子部品の製造方法
Abstract:
(EN) A wiring board (1) is provided with: a first layer (100); and a second layer (200) on one surface of the first layer (100). The first layer (100) is provided with: a plurality of first conductor parts (6); and resin parts (3) that are arranged between the first conductor parts (6) and that electrically separate the first conductor parts (6) from each other. The second layer (200) is provided with a plurality of second conductor parts (4) that are electrically separated from each other and brought into contact with the first conductor parts (6). Each of the second conductor parts (4) is in contact with the resin parts (3) at parts of the surface of the second conductor part (4) on the first layer (100) side.
(FR) Une carte de câblage (1) est pourvue : d'une première couche (100); et d'une seconde couche (200) sur une surface de la première couche (100). La première couche (100) comporte : une pluralité de premières parties conductrices (6); et des parties de résine (3) qui sont disposées entre les premières parties conductrices (6) et qui séparent électriquement les premières parties conductrices (6) les unes des autres. La seconde couche (200) est pourvue d'une pluralité de secondes parties conductrices (4) qui sont séparées électriquement les unes des autres et amenées en contact avec les premières parties conductrices (6). Chacune des secondes parties conductrices (4) est en contact avec les parties de résine (3) sur des parties de la surface de la seconde partie conductrice (4) sur le côté de la première couche (100).
(JA) 配線基板(1)は、第1層(100)と、第1層(100)の一方の面上の第2層(200)とを備えている。第1層(100)は、複数の第1導体部(6)と、複数の第1導体部(6)の間に配置されて複数の第1導体部(6)を電気的に分離する樹脂部(3)とを備えている。第2層(200)は、複数の第1導体部(6)のそれぞれと接するとともに互いに電気的に分離されている複数の第2導体部(4)を備えている。複数の第2導体部(4)は、それぞれ、第2導体部(4)の第1層(100)側の面の一部において、樹脂部(3)と接している。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020190025835CN109478536