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1. (WO2018008165) SOLDER ALLOY AND RESIN FLUX CORED SOLDER
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/008165    International Application No.:    PCT/JP2016/078974
Publication Date: 11.01.2018 International Filing Date: 30.09.2016
IPC:
B23K 35/26 (2006.01), B23K 35/14 (2006.01), C22C 13/00 (2006.01)
Applicants: KOKI COMPANY LIMITED [JP/JP]; 32-1, Senju Asahi-cho, Adachi-ku, Tokyo 1200026 (JP)
Inventors: YUKIKATA, Kazuhiro; (JP).
FURUSAWA, Mitsuyasu; (JP).
MORI, Kimiaki; (JP)
Agent: FUJIMOTO, Noboru; (JP)
Priority Data:
2016-132816 04.07.2016 JP
Title (EN) SOLDER ALLOY AND RESIN FLUX CORED SOLDER
(FR) ALLIAGE DE BRASAGE ET BRASAGE À FIL FOURRÉ DE FLUX DE RÉSINE
(JA) はんだ合金、ヤニ入りはんだ
Abstract: front page image
(EN)Provided is a solder alloy in which depletion of the plating layer can be effectively prevented, even under repeated contact in a molten state with a plating layer of which the primary component is Fe. This solder alloy comprises 0.01-0.1 mass% of Fe, 0.005 mass% or more but less than 0.02 mass% of Co, 0.1-4.5 mass% of Ag, 0.1-0.8 mass% of Cu, with the balance being Sn.
(FR)L'invention concerne un alliage de brasage dans lequel l'appauvrissement de la couche de placage peut être efficacement interdit, même sous contact répété à l'état fondu avec une couche de placage dont le composant primaire est Fe. Cet alliage de brasage comporte 0,01 à 0,1 % en masse de Fe, entre 0,005 % en masse et 0,02 % en masse de Co, de 0,1 à 4,5 % en masse d'Ag, de 0,1 à 0,8 % en masse de Cu, le reste étant du Sn.
(JA)Feを主成分とするメッキ層に対して溶融状態での接触を繰り返しても、メッキ層の喪失を効果的に防止することができるはんだ合金を提供する。 本発明のはんだ合金は、Feが0.01質量%以上0.1質量%以下、Coが0.005質量%以上0.02質量%未満、Agが0.1質量%以上4.5質量%以下、Cuが0.1質量%以上0.8質量%以下、残部がSnからなる。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)