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1. (WO2018007454) METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT, AND OPTOELECTRONIC COMPONENT

Pub. No.:    WO/2018/007454    International Application No.:    PCT/EP2017/066792
Publication Date: Fri Jan 12 00:59:59 CET 2018 International Filing Date: Thu Jul 06 01:59:59 CEST 2017
IPC: H01L 33/00
H01L 33/60
H01L 33/56
H01L 33/48
H01L 33/52
H01L 33/50
Applicants: OSRAM OPTO SEMICONDUCTORS GMBH
Inventors: GEBUHR, Tobias
PINDL, Markus
Title: METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT, AND OPTOELECTRONIC COMPONENT
Abstract:
A method for producing an optoelectronic component comprises steps for providing a carrier, for arranging a structured reflector above a top side of the carrier, for arranging an optoelectronic semiconductor chip having a top side and an underside opposite the top side in an opening of the reflector, wherein the underside of the optoelectronic semiconductor chip faces the top side of the carrier, for arranging an embedding material above the top side of the carrier, wherein the optoelectronic semiconductor chip is at least partly embedded into the embedding material, as a result of which a composite body comprising the optoelectronic semiconductor chip, the reflector and the embedding material is formed, and for detaching the composite body from the carrier.