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1. (WO2018005401) INORGANIC WAFER HAVING THROUGH-HOLES ATTACHED TO SEMICONDUCTOR WAFER

Pub. No.:    WO/2018/005401    International Application No.:    PCT/US2017/039357
Publication Date: Fri Jan 05 00:59:59 CET 2018 International Filing Date: Wed Jun 28 01:59:59 CEST 2017
IPC: H01L 21/311
H01L 21/48
H01L 23/15
H01L 23/498
Applicants: CORNING INCORPORATED
Inventors: LEVESQUE, Daniel Wayne, Jr.
PIECH, Garrett Andrew
SHOREY, Aric Bruce
Title: INORGANIC WAFER HAVING THROUGH-HOLES ATTACHED TO SEMICONDUCTOR WAFER
Abstract:
A process comprises bonding a semiconductor wafer to an inorganic wafer. The semiconductor wafer is opaque to a wavelength of light to which the inorganic wafer is transparent. After the bonding, a damage track is formed in the inorganic wafer using a laser that emits the wavelength of light. The damage track in the inorganic wafer is enlarged to form a hole through the inorganic wafer by etching. The hole terminates at an interface between the semiconductor wafer and the inorganic wafer. An article is also provided, comprising a semiconductor wafer bonded to an inorganic wafer. The semiconductor wafer is opaque to a wavelength of light to which the inorganic wafer is transparent. The inorganic wafer has a hole formed through the inorganic wafer. The hole terminates at an interface between the semiconductor wafer and the inorganic wafer.