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1. (WO2018005152) DEFORMABLE CONDUCTIVE CONTACTS

Pub. No.:    WO/2018/005152    International Application No.:    PCT/US2017/038182
Publication Date: Fri Jan 05 00:59:59 CET 2018 International Filing Date: Tue Jun 20 01:59:59 CEST 2017
IPC: H01L 27/06
H01L 23/00
H01L 21/56
Applicants: INVENSAS CORPORATION
Inventors: HABA, Belgacem
DESTEFANO, Thomas
Title: DEFORMABLE CONDUCTIVE CONTACTS
Abstract:
Deformable conductive contacts are provided. A plurality of deformable contacts on a first substrate may be joined to a plurality of conductive pads on a second substrate during die level or wafer level assembly of microelectronics. Each deformable contact complies to a degree that is related to the amount of joining pressure between the first substrate and the second substrate. Since an individual contact can make the conductive coupling within a range of distances from a target pad, an array of the deformable contacts provides tolerance and compliance when there is some variation in height of the conductive elements on either side of the join. A flowable underfill may be provided to press the deformable contacts against opposing pads and to permanently join the surfaces at a fixed distance. The deformable contacts may include a wiping feature to clear their target pads for establishing improved metal-to-metal contact or a thermocompression bond.