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1. (WO2018004686) DEVICE, METHOD AND SYSTEM FOR PROVIDING RECESSED INTERCONNECT STRUCTURES OF A SUBSTRATE

Pub. No.:    WO/2018/004686    International Application No.:    PCT/US2016/040832
Publication Date: Fri Jan 05 00:59:59 CET 2018 International Filing Date: Sat Jul 02 01:59:59 CEST 2016
IPC: H01L 23/538
H01L 23/498
H01L 23/525
H01L 23/00
H01L 25/065
Applicants: INTEL CORPORATION
Inventors: LOO, Howe Yin
SHARAN, Sujit
CHUAH, Tin Poay
PRABHAKUMAR, Ananth
Title: DEVICE, METHOD AND SYSTEM FOR PROVIDING RECESSED INTERCONNECT STRUCTURES OF A SUBSTRATE
Abstract:
Techniques and mechanisms to facilitate connectivity between circuit components via a substrate. In an embodiment, a microelectronic device includes a substrate, wherein a recess region extends from the first side of the substrate and only partially toward a second side of the substrate. First input/output (IO) contacts of a first hardware interface are disposed in the recess region. The first IO contacts are variously coupled to each to a respective metallization layer of the substrate, wherein the recess region extends though one or more other metallization layers of the substrate. In another embodiment, the microelectronic device further comprises second IO contacts of a second hardware interface, the second IO contacts to couple the microelectronic device to a printed circuit board.