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1. (WO2018004649) SYSTEMS, METHODS AND DEVICES FOR ETCHING CONTROL
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/004649    International Application No.:    PCT/US2016/040681
Publication Date: 04.01.2018 International Filing Date: 01.07.2016
IPC:
H01L 21/027 (2006.01), H01L 21/311 (2006.01), H01L 29/78 (2006.01), H01L 21/8238 (2006.01)
Applicants: INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95054 (US)
Inventors: SHYKIND, David; (US).
MCINTYRE, Brian J.; (US).
TUFTS, Bruce J.; (US)
Agent: HOLT, Benjamin J.; (US)
Priority Data:
Title (EN) SYSTEMS, METHODS AND DEVICES FOR ETCHING CONTROL
(FR) SYSTÈMES, PROCÉDÉS ET DISPOSITIFS DE COMMANDE DE GRAVURE
Abstract: front page image
(EN)Layers of materials enriched with chemical isotopes can delineate boundaries between materials in a semiconductor process. During an etch process, these boundary layers are removed by chemical reactions, giving rise to volatile reaction products. By using a mass spectrometer attached to the etch chamber to monitor the concentration of isotopically labeled compounds in the reaction products, the system can determine that the desired etch depth has been achieved and terminate the etch process.
(FR)L'invention concerne un processus à semiconducteur dans lequel des couches de matériaux enrichis en isotopes chimiques peuvent tracer les limites entre les matériaux. Pendant un processus de gravure, ces couches limites sont éliminées par des réactions chimiques, donnant lieu à des produits de réaction volatils. En utilisant un spectromètre de masse fixé à la chambre de gravure pour surveiller la concentration des composés marqués de manière isotopique dans les produits de réaction, le système peut déterminer que la profondeur de gravure souhaitée a été atteinte et mettre fin au processus de gravure.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)