WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2018004276) CHIP COMPONENT AND MANUFACTURING METHOD THEREFOR
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/004276    International Application No.:    PCT/KR2017/006909
Publication Date: 04.01.2018 International Filing Date: 29.06.2017
IPC:
H01G 4/40 (2006.01), H01G 4/232 (2006.01), H01G 2/14 (2006.01), H01G 4/30 (2006.01), C01G 51/00 (2006.01), C01G 9/02 (2006.01), C01G 45/02 (2006.01), C01G 29/00 (2006.01), H01F 17/00 (2006.01)
Applicants: MODA-INNOCHIPS CO., LTD. [KR/KR]; 42-7, Dongsan-ro 27beon-gil, Danwon-gu, Ansan-si, Gyeonggi-do 15433 (KR)
Inventors: BACK, Jung Cheel; (KR).
LEE, Jung Hun; (KR).
KIM, Jung Chai; (KR).
KIM, Joo Sung; (KR)
Agent: NAM, Seung-Hee; (KR)
Priority Data:
10-2016-0083680 01.07.2016 KR
Title (EN) CHIP COMPONENT AND MANUFACTURING METHOD THEREFOR
(FR) COMPOSANT DE PUCE ET SON PROCÉDÉ DE FABRICATION
(KO) 칩 부품 및 그 제조 방법
Abstract: front page image
(EN)The present invention provides a chip component and a manufacturing method therefor, the chip component comprising a laminate, and a surface modified member formed on at least one region of the laminate, wherein the surface modified member exposes at least a portion of the surface of the laminate.
(FR)La présente invention concerne un composant de puce et son procédé de fabrication, le composant de puce comprenant un stratifié, et un élément modifié en surface formé sur au moins une région du stratifié, l'élément modifié en surface exposant au moins une portion de la surface du stratifié.
(KO)본 발명은 적층체와, 적층체의 적어도 일 영역에 형성된 표면 개질 부재를 포함하고, 표면 개질 부재는 적층체 표면의 적어도 일부를 노출시키도록 형성된 칩 부품 및 그 제조 방법을 제시한다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)