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|1. (WO2018004050) ULTRAVIOLET-CURABLE ADHESIVE SHEET FOR BACKSIDE GRINDING AFTER HALF-CUTTING SEMICONDUCTOR WAFER|
|Applicants:||FINE TECHNOLOGY CO.,LTD.
|Inventors:||LEE, Dong Ho
SEO, Young Ok
|Title:||ULTRAVIOLET-CURABLE ADHESIVE SHEET FOR BACKSIDE GRINDING AFTER HALF-CUTTING SEMICONDUCTOR WAFER|
The present invention relates to an ultraviolet-curable adhesive sheet for backside grinding after half-cutting a semiconductor wafer having a circuit and a bump formed thereon, which allows the thickness of the wafer to be polished as thin as possible, and allows the polished semiconductor wafer to be easily separated into individual chips while protecting the surface of a protruding part of the bump when backside grinding after half-cutting a semiconductor wafer having a circuit and bump formed thereon. By having a UV-curable adhesive layer, high adhesion strength should be maintained prior to UV-irradiation, but semiconductor chips can be easily peeled off after UV-irradiation, and no residual adhesive is left on the surface of the semiconductor chips from the peeling process. In addition, by having a soft layer, the bump and circuit are buried during backside grinding of the semiconductor wafer, and during the grinding process the bump and circuit are protected from external shear stress and the bump or the wafer is prevented from breaking. Furthermore, the present invention provides a substrate layer with a three-layer structure having a substrate film layer, a hard layer, and a surface-roughness film layer laminated in a given order; and thereby the UV-curable adhesive sheet can improve the adhesion and fixing strength to a wafer grinding equipment chuck table, and thickness variations in the semiconductor wafer can be minimised during the semiconductor wafer grinding process.