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1. (WO2018004050) ULTRAVIOLET-CURABLE ADHESIVE SHEET FOR BACKSIDE GRINDING AFTER HALF-CUTTING SEMICONDUCTOR WAFER

Pub. No.:    WO/2018/004050    International Application No.:    PCT/KR2016/007755
Publication Date: Fri Jan 05 00:59:59 CET 2018 International Filing Date: Sat Jul 16 01:59:59 CEST 2016
IPC: H01L 21/683
H01L 21/78
H01L 21/02
H01L 21/304
H01L 21/306
H01L 21/20
Applicants: FINE TECHNOLOGY CO.,LTD.
(주)화인테크놀리지
Inventors: LEE, Dong Ho
이동호
SEO, Young Ok
서영옥
Title: ULTRAVIOLET-CURABLE ADHESIVE SHEET FOR BACKSIDE GRINDING AFTER HALF-CUTTING SEMICONDUCTOR WAFER
Abstract:
The present invention relates to an ultraviolet-curable adhesive sheet for backside grinding after half-cutting a semiconductor wafer having a circuit and a bump formed thereon, which allows the thickness of the wafer to be polished as thin as possible, and allows the polished semiconductor wafer to be easily separated into individual chips while protecting the surface of a protruding part of the bump when backside grinding after half-cutting a semiconductor wafer having a circuit and bump formed thereon. By having a UV-curable adhesive layer, high adhesion strength should be maintained prior to UV-irradiation, but semiconductor chips can be easily peeled off after UV-irradiation, and no residual adhesive is left on the surface of the semiconductor chips from the peeling process. In addition, by having a soft layer, the bump and circuit are buried during backside grinding of the semiconductor wafer, and during the grinding process the bump and circuit are protected from external shear stress and the bump or the wafer is prevented from breaking. Furthermore, the present invention provides a substrate layer with a three-layer structure having a substrate film layer, a hard layer, and a surface-roughness film layer laminated in a given order; and thereby the UV-curable adhesive sheet can improve the adhesion and fixing strength to a wafer grinding equipment chuck table, and thickness variations in the semiconductor wafer can be minimised during the semiconductor wafer grinding process.