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1. (WO2018003981) COMPOSITION
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/003981 International Application No.: PCT/JP2017/024201
Publication Date: 04.01.2018 International Filing Date: 30.06.2017
IPC:
C08F 290/06 (2006.01) ,C09J 4/02 (2006.01) ,C09J 11/06 (2006.01) ,C09J 11/08 (2006.01) ,H01L 21/304 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
290
Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
02
on to polymers modified by introduction of unsaturated end groups
06
Polymers provided for in subclass C08G52
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
4
Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
02
Acrylmonomers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
06
organic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
08
Macromolecular additives
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
Applicants:
デンカ株式会社 DENKA COMPANY LIMITED [JP/JP]; 東京都中央区日本橋室町二丁目1番1号 1-1,Nihonbashi-Muromachi 2-Chome,Chuo-ku, Tokyo 1038338, JP
Inventors:
関谷 瑠璃子 SEKIYA,Ruriko; JP
山下 幸彦 YAMASHITA,Yukihiko; JP
渡辺 淳 WATANABE,Jun; JP
Agent:
アクシス国際特許業務法人 AXIS PATENT INTERNATIONAL; 東京都港区新橋二丁目6番2号 新橋アイマークビル Shimbashi i-mark Bldg., 6-2 Shimbashi 2-Chome,Minato-ku, Tokyo 1050004, JP
Priority Data:
2016-13126601.07.2016JP
Title (EN) COMPOSITION
(FR) COMPOSITION
(JA) 組成物
Abstract:
(EN) A composition having heat resistance, adhesiveness, and strippability is provided. The composition comprises the following components (A) to (E): component (A) is a monofunctional (meth)acrylate having a number-average molecular weight less than 1,000; compound (B) is a polyfunctional (meth)acrylate having a number-average molecular weight less than 1,000; compound (C) is a radical polymerization initiator; component (D) is a strippability-imparting compound; and component (E) is a polyfunctional urethane (meth)acrylate. The composition gives a temporary fixing adhesive for semiconductor manufacturing.
(FR) L'invention concerne une composition présentant une résistance à la chaleur, une adhésivité et une aptitude au décapage. La composition comprend les composants (A) à (E) suivants : le composant (A) est un (méth)acrylate monofonctionnel ayant un poids moléculaire moyen en nombre inférieur à 1000 ; le composé (B) est un (meth)acrylate polyfonctionnel ayant un poids moléculaire moyen en nombre inférieur à 1000 ; le composé (C) est un initiateur de polymérisation radicalaire ; le composant (D) est un composé conférant une aptitude au décapage ; et le composant (E) est un (méth) acrylate d'uréthane polyfonctionnel. La composition fournit un adhésif de fixation temporaire pour la fabrication de semi-conducteurs.
(JA) 耐熱性、接着性、剥離性を有する組成物の提供。下記(A)~(E)成分を含有する組成物。(A)成分 数平均分子量が1000未満の単官能(メタ)アクリレート、(B)成分 数平均分子量が1000未満の多官能(メタ)アクリレート、(C)成分 ラジカル重合開始剤、(D)成分 離型性付与化合物、(E)成分 多官能ウレタン(メタ)アクリレート。この組成物からなる半導体製造用仮固定接着剤。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)