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1. (WO2018003760) FLUX COMPOSITION, SOLDER PASTE COMPOSITION, AND ELECTRONIC CIRCUIT BOARD

Pub. No.:    WO/2018/003760    International Application No.:    PCT/JP2017/023462
Publication Date: Fri Jan 05 00:59:59 CET 2018 International Filing Date: Tue Jun 27 01:59:59 CEST 2017
IPC: B23K 35/363
B23K 35/26
C22C 13/00
C22C 13/02
C22C 12/00
Applicants: TAMURA CORPORATION
株式会社タムラ製作所
Inventors: ARAI Masaya
新井 正也
KATSUYAMA Tsukasa
勝山 司
NAKANO Takeshi
中野 健
HORI Atsushi
堀 敦史
MUNEKAWA Yurika
宗川 裕里加
Title: FLUX COMPOSITION, SOLDER PASTE COMPOSITION, AND ELECTRONIC CIRCUIT BOARD
Abstract:
The purpose of the invention is to provide a flux composition and a solder paste composition with which it is possible to suppress the stickiness of flux residue after soldering while suppressing the creation of voids during reflow soldering. To achieve this purpose, this flux composition is a flux composition that constitutes a solder paste composition by being mixed with a solder alloy powder, the flux composition comprising (A) a base resin, (B) an activator, (C) a thixotropic agent, and (D) a solvent, and being characterized in that: the solvent (D) includes (D-1) an organic acid ester that neither includes a carboxyl group nor a hydroxyl group; the temperature at which the weight reduction rate (measured by employing the TG method) of the organic acid ester (D-1) becomes 100 mass% is at least 180°C and at most 50°C above the melting peak temperature of the solder alloy constituting the solder alloy powder; and the amount of the organic acid ester (D-1) blended is from 10 mass% to 100 mass% with respect to the total amount of the solvent (D).