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|1. (WO2018003760) FLUX COMPOSITION, SOLDER PASTE COMPOSITION, AND ELECTRONIC CIRCUIT BOARD|
|Title:||FLUX COMPOSITION, SOLDER PASTE COMPOSITION, AND ELECTRONIC CIRCUIT BOARD|
The purpose of the invention is to provide a flux composition and a solder paste composition with which it is possible to suppress the stickiness of flux residue after soldering while suppressing the creation of voids during reflow soldering. To achieve this purpose, this flux composition is a flux composition that constitutes a solder paste composition by being mixed with a solder alloy powder, the flux composition comprising (A) a base resin, (B) an activator, (C) a thixotropic agent, and (D) a solvent, and being characterized in that: the solvent (D) includes (D-1) an organic acid ester that neither includes a carboxyl group nor a hydroxyl group; the temperature at which the weight reduction rate (measured by employing the TG method) of the organic acid ester (D-1) becomes 100 mass% is at least 180°C and at most 50°C above the melting peak temperature of the solder alloy constituting the solder alloy powder; and the amount of the organic acid ester (D-1) blended is from 10 mass% to 100 mass% with respect to the total amount of the solvent (D).