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1. (WO2018003429) BLADE DRESSING MECHANISM, CUTTING DEVICE COMPRISING SAME MECHANISM, AND BLADE DRESSING METHOD USING SAME MECHANISM
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2018/003429 International Application No.: PCT/JP2017/020987
Publication Date: 04.01.2018 International Filing Date: 06.06.2017
IPC:
B24B 53/00 (2006.01) ,B24B 27/06 (2006.01) ,H01L 21/301 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
53
Devices or means for dressing or conditioning abrasive surfaces
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
27
Other grinding machines or devices
06
Grinders for cutting-off
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301
to subdivide a semiconductor body into separate parts, e.g. making partitions
Applicants:
株式会社リード READ CO.,LTD. [JP/JP]; 神奈川県横浜市西区みなとみらい2-2-1 2-2-1, Minato Mirai, Nishi-ku, Yokohama-shi, Kanagawa 2208143, JP
Inventors:
大槻俊紀 OTSUKI Toshinori; JP
渡辺勝行 WATANABE Katsuyuki; JP
片岡光宗 KATAOKA Mitsuhiro; JP
Agent:
林直生樹 HAYASHI Naoki; JP
林宏 HAYASHI Hiroshi; JP
石川徹 ISHIKAWA Toru; JP
Priority Data:
2016-12724028.06.2016JP
Title (EN) BLADE DRESSING MECHANISM, CUTTING DEVICE COMPRISING SAME MECHANISM, AND BLADE DRESSING METHOD USING SAME MECHANISM
(FR) MÉCANISME DE DRESSAGE DE LAMES, DISPOSITIF DE COUPE COMPRENANT LEDIT MÉCANISME ET PROCÉDÉ DE DRESSAGE DE LAMES UTILISANT LEDIT MÉCANISME
(JA) ブレードのドレッシング機構及び該機構を備えた切削装置及び該機構を用いたブレードのドレッシング方法
Abstract:
(EN) [Problem] To provide a dressing mechanism that can achieve dressing of a workpiece cutting blade while saving space, a cutting device comprising such a dressing mechanism, and a blade dressing method using the dressing mechanism. [Solution] A dresser 10 to perform dressing of a blade 3 for workpiece cutting is provided to be able to rotate about a second axis L2 that is parallel to a first axis L1 of the blade 3. In addition, the outer circumferential face 11 of the dresser is provided with, in the circumferential direction, a dress area 12 that is in sliding contact with a cutting portion 3a of the blade and a relief area 13 that is not in contact with the cutting portion when same are facing the outer circumferential surface of the blade. Selectively switching between a dressing state by way of the dress area and a non-dressing state by way of the relief area is possible by rotating the dresser about the axis L2.
(FR) Le problème décrit par la présente invention est de fournir un mécanisme de dressage qui permet d'obtenir un dressage d'une lame de coupe de pièce tout en économisant de l'espace, un dispositif de coupe comprenant ledit mécanisme de dressage, et un procédé de dressage de lames utilisant le mécanisme de dressage. La solution selon la présente invention porte sur outil de dressage (10) pour réaliser le dressage d'une lame (3) pour la découpe d'une pièce, qui est conçu pour pouvoir se mettre en rotation autour d'un second axe (L2) qui est parallèle à un premier axe (L1) de la lame (3). De plus, la face circonférentielle externe (11) de l'outil de dressage est pourvue, dans la direction circonférentielle, d'une zone de robe (12) qui est en contact coulissant avec une partie de coupe (3a) de la lame et une zone de dégagement (13) qui n'est pas en contact avec la partie de coupe lorsque celles-ci font face à la surface circonférentielle extérieure de la lame. La commutation sélective entre un état de dressage au moyen de la zone de dressage et un état de non-dressage par l'intermédiaire de la zone de dégagement est possible par rotation de l'outil de dressage autour de l'axe (L2).
(JA) 【課題】ワーク切削用ブレードのドレッシングを省スペースにて実現することが可能なドレッシング機構、そのようなドレッシング機構を備えた切削装置、及び該ドレッシング機構を用いたブレードのドレッシング方法を提供することにある。 【解決手段】ワーク切削用のブレード3のドレッシングを行うドレッサ10が、ブレード3の第1軸L1と平行を成す第2軸L2周りに回動可能に設けられ、またドレッサの外周面11には、ブレードの外周面に対向させたときに、該ブレードの刃部3aに摺接するドレス領域12と、該刃部と非接触状態となる逃げ領域13と周方向に沿って設けられ、該ドレッサをその軸L2周りに回動させることで、ドレス領域によるドレッシング状態と、逃げ領域による非ドレッシング状態とを選択的に切り換えることができるようにした。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN109414800MYPI 2018002386KR1020190022572