WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2018003356) HEAT DISSIPATING DEVICE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/003356    International Application No.:    PCT/JP2017/019334
Publication Date: 04.01.2018 International Filing Date: 24.05.2017
IPC:
H05K 7/20 (2006.01), H01L 23/36 (2006.01)
Applicants: ZEON CORPORATION [JP/JP]; 6-2, Marunouchi 1-chome, Chiyoda-ku Tokyo 1008246 (JP)
Inventors: KOBAYASHI Gen; (JP).
MURAKAMI Yasuyuki; (JP).
UCHIUMI Daisuke; (JP)
Agent: SUGIMURA Kenji; (JP)
Priority Data:
2016-128122 28.06.2016 JP
Title (EN) HEAT DISSIPATING DEVICE
(FR) DISPOSITIF DE DISSIPATION DE CHALEUR
(JA) 放熱装置
Abstract: front page image
(EN)Provided is a heat dissipating device capable of achieving high heat dissipating performance. This heat dissipating device is provided with a heat generating body, a heat dissipating body, and a heat transfer sheet that is sandwiched between the heat generating body and the heat dissipating body. The heat conductivity of the heat transfer sheet is 15 W/m∙K or higher in the thickness direction, and the area of the sandwiched surface is smaller than the area of the contact surface of the heat generating body and the area of the contact surface of the heat dissipating body.
(FR)La présente invention concerne un dispositif de dissipation de chaleur permettant de réaliser une haute performance de dissipation de chaleur. Ce dispositif de dissipation de chaleur est pourvu d'un corps de génération de chaleur, d'un corps de dissipation de chaleur et d'une feuille de transfert de chaleur qui est intercalée entre le corps de génération de chaleur et le corps de dissipation de chaleur. La conductivité thermique de la feuille de transfert de chaleur est de 15 W/m∙K ou plus dans le sens de l'épaisseur, et la surface de la surface intercalée est inférieure à la surface de la surface de contact du corps de génération de chaleur et à la surface de la surface de contact du corps de dissipation de chaleur.
(JA)高い放熱性を実現し得る放熱装置を提供する。本発明の放熱装置は、発熱体と、放熱体と、前記発熱体および前記放熱体の間に挟着された熱伝導シートと、を備え、前記熱伝導シートの厚み方向の熱伝導率が15W/m・K以上であり、且つ挟着面の面積が前記発熱体および前記放熱体の被着面の面積よりも小さい。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)