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1. (WO2018003313) RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2018/003313 International Application No.: PCT/JP2017/018032
Publication Date: 04.01.2018 International Filing Date: 12.05.2017
IPC:
C08G 59/20 (2006.01) ,H05K 1/03 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
20
characterised by the epoxy compounds used
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants:
三菱瓦斯化学株式会社 MITSUBISHI GAS CHEMICAL COMPANY, INC. [JP/JP]; 東京都千代田区丸の内二丁目5番2号 5-2, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008324, JP
Inventors:
喜多村 慎也 KITAMURA, Shinya; JP
鈴木 卓也 SUZUKI, Takuya; JP
四家 誠司 SHIKA, Seiji; JP
Agent:
稲葉 良幸 INABA, Yoshiyuki; JP
大貫 敏史 ONUKI, Toshifumi; JP
内藤 和彦 NAITO, Kazuhiko; JP
Priority Data:
2016-12872129.06.2016JP
2017-01331527.01.2017JP
Title (EN) RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE
(FR) COMPOSITION DE RÉSINE, FEUILLE DE RÉSINE, CARTE DE CIRCUIT IMPRIMÉ MULTICOUCHE ET DISPOSITIF SEMI-CONDUCTEUR
(JA) 樹脂組成物、樹脂シート、多層プリント配線板及び半導体装置
Abstract:
(EN) Provided is a resin composition that, when used in a multilayer printed circuit board, exhibits superior heat resistance and coating, and exhibits superior plating adhesion and developability. Also provided are a resin sheet with a support body, and a multilayer printed circuit board and a semiconductor device that use said resin composition and said resin sheet with a support body. The resin composition includes a dicyclopentadiene-type epoxy resin (A) expressed by formula (1), a photocuring initiator (B), a compound (C) expressed by formula (2), and a compound (D) that has an ethylenically unsaturated group other than the (C) component.
(FR) L'invention concerne une composition de résine qui, lorsqu'elle est utilisée dans une carte de circuit imprimé multicouche, présente une résistance à la chaleur et un revêtement supérieurs et qui présente une adhérence de placage et une aptitude au développement supérieures. L'invention concerne également une feuille de résine présentant un corps support et une carte de circuit imprimé multicouche et un dispositif semi-conducteur qui utilisent ladite composition de résine et ladite feuille de résine avec présentant un corps support. La composition de résine comprend une résine époxy de type dicyclopentadiène (A) exprimée par la formule (1), un initiateur de photodurcissement (B), un composé (C) exprimé par la formule (2) et un composé (D) qui présente un groupe éthyléniquement insaturé autre que le composant (C).
(JA) 多層プリント配線板に用いた際に、塗膜性及び耐熱性に優れ、めっき密着性、現像性に優れる樹脂組成物、支持体付き樹脂シート、それらを用いた多層プリント配線板、半導体装置を提供する。下記式(1)で表されるジシクロペンタジエン型エポキシ樹脂(A)、光硬化開始剤(B)、下記式(2)で表される化合物(C)及び該(C)成分以外のエチレン性不飽和基を有する化合物(D)を含有する、樹脂組成物。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN109415489KR1020190022517