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1. (WO2018003313) RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE

Pub. No.:    WO/2018/003313    International Application No.:    PCT/JP2017/018032
Publication Date: Fri Jan 05 00:59:59 CET 2018 International Filing Date: Sat May 13 01:59:59 CEST 2017
IPC: C08G 59/20
H05K 1/03
Applicants: MITSUBISHI GAS CHEMICAL COMPANY, INC.
三菱瓦斯化学株式会社
Inventors: KITAMURA, Shinya
喜多村 慎也
SUZUKI, Takuya
鈴木 卓也
SHIKA, Seiji
四家 誠司
Title: RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE
Abstract:
Provided is a resin composition that, when used in a multilayer printed circuit board, exhibits superior heat resistance and coating, and exhibits superior plating adhesion and developability. Also provided are a resin sheet with a support body, and a multilayer printed circuit board and a semiconductor device that use said resin composition and said resin sheet with a support body. The resin composition includes a dicyclopentadiene-type epoxy resin (A) expressed by formula (1), a photocuring initiator (B), a compound (C) expressed by formula (2), and a compound (D) that has an ethylenically unsaturated group other than the (C) component.