WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Options
Query Language
Stem
Sort by:
List Length
Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2018003164) AIRTIGHT PACKAGE AND METHOD FOR MANUFACTURING SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/003164 International Application No.: PCT/JP2017/006086
Publication Date: 04.01.2018 International Filing Date: 20.02.2017
IPC:
H01L 23/02 (2006.01) ,H01L 23/08 (2006.01) ,H01L 33/48 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
06
characterised by the material of the container or its electrical properties
08
the material being an electrical insulator, e.g. glass
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
Applicants: NIPPON ELECTRIC GLASS CO., LTD.[JP/JP]; 7-1, Seiran 2-chome, Otsu-shi, Shiga 5208639, JP
Inventors: OKA, Takuji; JP
YABUUCHI, Koichi; JP
SHIRAGAMI, Toru; JP
Agent: MIYAZAKI & METSUGI; Chuo Odori FN Bldg., 3-8, Tokiwamachi 1-chome, Chuo-ku, Osaka-shi, Osaka 5400028, JP
Priority Data:
2016-12883829.06.2016JP
Title (EN) AIRTIGHT PACKAGE AND METHOD FOR MANUFACTURING SAME
(FR) EMBALLAGE HERMÉTIQUE ET SON PROCÉDÉ DE FABRICATION
(JA) 気密パッケージ及びその製造方法
Abstract:
(EN) Provided are: an airtight package enabling to improve bonding strength between a sealing material layer and a container; and a method for manufacturing the airtight package. An airtight package 1 is provided with: a container 2 having a frame section 3; a glass cover 4, which is disposed on the frame section 3, and which seals the container 2; and a sealing material layer 5, which is disposed between the frame section 3 and the glass cover 4, and which bonds the glass cover 4 and the container 2 to each other. The airtight package is characterized by having the sealing material layer 5 wherein a bonding surface 5b between the sealing material layer 5 and the container 2 is larger than a bonding surface 5a between the sealing material layer 5 and the glass cover 4.
(FR) L'invention concerne un emballage hermétique qui permet d'améliorer la résistance de liaison entre une couche de matériau d'étanchéité et un récipient ; et un procédé de fabrication de l'emballage hermétique. Un emballage hermétique (1) comprend : un récipient (2) pourvue d'une section de cadre (3) ; un couvercle en verre (4) qui est disposé sur la section de cadre (3) et qui scelle le récipient (2) ; et une couche de matériau d'étanchéité (5) qui est disposée entre la section de cadre (3) et le couvercle en verre (4) et qui lie le couvercle en verre (4) et le récipient (2) l'un à l'autre. L'emballage hermétique est caractérisé en ce qu'il comporte une couche de matériau d'étanchéité (5). Une surface de liaison (5b) entre la couche de matériau d'étanchéité (5) et le récipient (2) est plus grande qu'une surface de liaison (5a) entre la couche de matériau d'étanchéité (5) et le couvercle en verre (4).
(JA) 封着材料層と容器の接合強度を高めることができる気密パッケージ及びその製造方法を提供する。 枠部3を有する容器2と、枠部3の上に配置され、容器2を封止するガラス蓋4と、枠部3とガラス蓋4の間に配置され、ガラス蓋4と容器2を接合する封着材料層5とを備えた気密パッケージ1において、封着材料層5において、封着材料層5と容器2との接合面5bが、封着材料層5とガラス蓋4との接合面5aよりも大きいことを特徴としている。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)