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|1. (WO2018003099) COOLING APPARATUS|
|Applicants:||MITSUBISHI ELECTRIC CORPORATION
A cooling apparatus according to the present invention is provided with: a heat source device having a compressor that compresses a refrigerant and a first heat exchanger that condenses the refrigerant compressed by the compressor; and a load cooling device having a second heat exchanger that is connected to the heat source device through refrigerant piping and that cools water or antifreeze liquid from a load facility by use of the refrigerant flowing in through the refrigerant piping. The load cooling device is provided at a location closer to the load facility than the heat source device, and is connected to load side piping that has a pump causing water or antifreeze liquid from the load facility to circulate.