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1. (WO2018002754) THERMAL INTERFACE MATERIAL STRUCTURES
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/002754 International Application No.: PCT/IB2017/053491
Publication Date: 04.01.2018 International Filing Date: 13.06.2017
IPC:
H01L 23/373 (2006.01) ,H05K 7/20 (2006.01)
Applicants: INTERNATIONAL BUSINESS MACHINES CORPORATION[US/US]; New Orchard Road Armonk, New York 10504, US
IBM UNITED KINGDOM LIMITED[GB/GB]; PO Box 41, North Harbour Portsmouth Hampshire PO6 3AU, GB (MG)
IBM (CHINA) INVESTMENT COMPANY LIMITED[CN/CN]; 25/F, Pangu Plaza No.27, Central North 4th Ring Road, Chaoyang District, Beijing 100101, CN (MG)
Inventors: HOFFMEYER, Mark; US
MANN, Phillip; US
Agent: LITHERLAND, David; GB
Priority Data:
15/193,18627.06.2016US
Title (EN) THERMAL INTERFACE MATERIAL STRUCTURES
(FR) STRUCTURES DE MATÉRIAU D'INTERFACE THERMIQUE
Abstract: front page image
(EN) A thermal interface material (TIM) structure includes a first thermal interface material layer and a second thermal interface material layer. The second thermal interface material layer overlaps the first thermal interface material layer.
(FR) Une structure de matériau d'interface thermique (TIM) comprend une première couche de matériau d'interface thermique et une seconde couche de matériau d'interface thermique. La seconde couche de matériau d'interface thermique chevauche la première couche de matériau d'interface thermique.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)