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1. (WO2018001071) METHOD OF FORMING THROUGH HOLE IN METAL MEMBER, ELECTRONIC APPARATUS HOUSING, AND ELECTRONIC APPARATUS

Pub. No.:    WO/2018/001071    International Application No.:    PCT/CN2017/087798
Publication Date: Fri Jan 05 00:59:59 CET 2018 International Filing Date: Sat Jun 10 01:59:59 CEST 2017
IPC: B23P 15/00
B21C 23/04
H04M 1/02
H05K 5/04
Applicants: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
广东欧珀移动通信有限公司
Inventors: XU, Haiping
许海平
CHENG, Jiao
成蛟
Title: METHOD OF FORMING THROUGH HOLE IN METAL MEMBER, ELECTRONIC APPARATUS HOUSING, AND ELECTRONIC APPARATUS
Abstract:
A method of forming a through hole (1) in a metal member on an electronic apparatus housing. The method of forming a through hole (1) in a metal member comprises: stamping the metal member at a hole position to form a protrusion structure (8), pressing the protrusion structure (8) in the reverse direction of the stamping operation forming the protrusion structure (8), and then cutting an end portion of the protrusion structure (8) to form a through hole (1).