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1. (WO2018000916) PCB ASSEMBLY AND MOBILE TERMINAL HAVING SAME PCB ASSEMBLY

Pub. No.:    WO/2018/000916    International Application No.:    PCT/CN2017/080959
Publication Date: Fri Jan 05 00:59:59 CET 2018 International Filing Date: Wed Apr 19 01:59:59 CEST 2017
IPC: H05K 1/02
H05K 1/11
Applicants: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
广东欧珀移动通信有限公司
Inventors: FAN, Yanhui
范艳辉
Title: PCB ASSEMBLY AND MOBILE TERMINAL HAVING SAME PCB ASSEMBLY
Abstract:
A PCB assembly (100) and a mobile terminal having the same PCB assembly, wherein the PCB assembly (100) comprises: a chip (1), a board (2) and a conductive member (3); the board (2) is provided with a grounding point thereon and comprises a multi-layer laminated conductive layer; the multi-layer laminated conductive layer includes a first conductive layer (21) and a second conductive layer (22) adjacent to the first conductive layer (21); the chip (1) is provided on the first conductive layer (21); the first conductive layer (21) is provided with a groove (23) thereon at a position close to the chip (1); the groove (23) passes through the first conductive layer (21); the conductive member (3) is laid on the second conductive layer (22) and disposed opposite the groove (23); the conductive member (3) is electrically connected to the grounding point.