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Machine translation
1. (WO2018000916) PCB ASSEMBLY AND MOBILE TERMINAL HAVING SAME PCB ASSEMBLY
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/000916    International Application No.:    PCT/CN2017/080959
Publication Date: 04.01.2018 International Filing Date: 18.04.2017
IPC:
H05K 1/02 (2006.01), H05K 1/11 (2006.01)
Applicants: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD. [CN/CN]; No. 18, Haibin Road, Wusha, Chang'an Dongguan, Guangdong 523860 (CN)
Inventors: FAN, Yanhui; (CN)
Agent: TSINGYIHUA INTELLECTUAL PROPERTY LLC; Room 301 Trade Building, Zhaolanyuan, Tsinghua University Qinghuayuan, Haidian District Beijing 100084 (CN)
Priority Data:
201610507604.4 28.06.2016 CN
Title (EN) PCB ASSEMBLY AND MOBILE TERMINAL HAVING SAME PCB ASSEMBLY
(FR) ENSEMBLE PCB ET TERMINAL MOBILE COMPORTANT LE MÊME ENSEMBLE PCB
(ZH) PCB板组件及具有其的移动终端
Abstract: front page image
(EN)A PCB assembly (100) and a mobile terminal having the same PCB assembly, wherein the PCB assembly (100) comprises: a chip (1), a board (2) and a conductive member (3); the board (2) is provided with a grounding point thereon and comprises a multi-layer laminated conductive layer; the multi-layer laminated conductive layer includes a first conductive layer (21) and a second conductive layer (22) adjacent to the first conductive layer (21); the chip (1) is provided on the first conductive layer (21); the first conductive layer (21) is provided with a groove (23) thereon at a position close to the chip (1); the groove (23) passes through the first conductive layer (21); the conductive member (3) is laid on the second conductive layer (22) and disposed opposite the groove (23); the conductive member (3) is electrically connected to the grounding point.
(FR)L'invention concerne un ensemble PCB (100) et un terminal mobile comportant le même ensemble PCB, l'ensemble PCB (100) comprenant : une puce (1), une carte (2) et un élément conducteur (3); la carte (2) est pourvue d'un point de mise à la terre dessus et comprend une couche conductrice stratifiée multicouche; la couche conductrice stratifiée multicouche comprend une première couche conductrice (21) et une deuxième couche conductrice (22) adjacente à la première couche conductrice (21); la puce (1) est disposée sur la première couche conductrice (21); la première couche conductrice (21) est pourvue d'une rainure (23) dessus à une position proche de la puce (1); la rainure (23) traverse la première couche conductrice (21); l'élément conducteur (3) est appliqué sur la deuxième couche conductrice (22) et est disposé à l'opposé de la rainure (23); l'élément conducteur (3) est connecté électriquement au point de mise à la terre.
(ZH)一种PCB板组件(100)及具有其的移动终端,其中,PCB板组件(100)包括芯片(1)、板体(2)和导电件(3),板体(2)上设有接地点且包括多层层叠放置的导电层,多层导电层包括第一导电层(21)和与第一导电层(21)相邻的第二导电层(22),芯片(1)设在第一导电层(21)上,第一导电层(21)上靠近芯片(1)的位置处设有凹槽(23),凹槽(23)贯通第一导电层(21),导电件(3)铺设在第二导电层(22)上且与凹槽(23)相对设置,导电件(3)与接地点电连接。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)