Processing

Please wait...

Settings

Settings

Goto Application

1. WO2017221218 - LASER-ASSISTED HERMETIC ENCAPSULATION PROCESS AND PRODUCT THEREOF

Publication Number WO/2017/221218
Publication Date 28.12.2017
International Application No. PCT/IB2017/053808
International Filing Date 26.06.2017
IPC
C03C 27/06 2006.01
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
CCHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
27Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
06Joining glass to glass by processes other than fusing
B23K 1/005 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
005Soldering by means of radiant energy
B29C 65/14 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65Joining of preformed parts; Apparatus therefor
02by heating, with or without pressure
14using wave energy or particle radiation
B29C 65/16 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65Joining of preformed parts; Apparatus therefor
02by heating, with or without pressure
14using wave energy or particle radiation
16Laser beam
B29C 65/48 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65Joining of preformed parts; Apparatus therefor
48using adhesives
B23K 26/20 2014.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
20Bonding
CPC
C03C 27/042
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
27Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
04Joining glass to metal by means of an interlayer
042consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
C03C 27/06
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
27Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
06Joining glass to glass by processes other than fusing
H01L 51/5246
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
5237Passivation; Containers; Encapsulation, e.g. against humidity
524Sealing arrangements having a self-supporting structure, e.g. containers
5246characterised by the peripheral sealing arrangements, e.g. adhesives, sealants
Applicants
  • EFACEC ENGENHARIA E SISTEMAS, S.A. [PT]/[PT]
Inventors
  • MAGALHÃES MENDES, Adélio Miguel
  • MAGALHÃES MENDES, Joaquim Gabriel
  • MADUREIRA ANDRADE, Luísa Manuela
  • EMAMI, Seyedali
  • SANTOS MARTINS, Jorge Filipe
  • DOS SANTOS PINTO, Jorge Miguel
Agents
  • HUMBERTO FERREIRA, lUIS
Priority Data
10948925.06.2016PT
10982602.01.2017PT
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) LASER-ASSISTED HERMETIC ENCAPSULATION PROCESS AND PRODUCT THEREOF
(FR) PROCÉDÉ D'ENCAPSULATION HERMÉTIQUE ASSISTÉ PAR LASER ET PRODUIT ASSOCIÉ
Abstract
(EN)
Electronic device encapsulation process, assisted by a laser, for obtaining a sealed electronic device, wherein said process comprises: providing a first substrate and a second substrate, the second substrate being transparent in the emission wavelength of the laser, depositing an intermediate bonding contour layer on one or both of the substrates; depositing electronic device components on one or both of the substrates; joining the first substrate and second substrate with the electronic device components in-between the substrates; using the laser to direct a laser beam onto the intermediate bonding contour layer with a predefined progressive scan pattern, such that the intermediate bonding contour layer is progressively melted and forms a seal, bonding the substrates together. Preferably, each linear laser pass overlaps longitudinally the previous and the following linear laser passes along said contour. Preferably, each linear laser pass is followed by a partial backtrack of the each linear laser pass, such that a part of the linear laser pass overlaps longitudinally the previous linear laser pass.
(FR)
La présente invention concerne un procédé d'encapsulation de dispositif électronique, assisté par laser, pour obtenir un dispositif électronique étanche, ledit procédé comprenant : la fourniture d'un premier substrat et d'un second substrat, le second substrat étant transparent dans la longueur d'onde d'émission du laser, le dépôt d'une couche de contour de liaison intermédiaire sur un substrat ou les deux, le dépôt des composants de dispositif électronique sur un substrat ou les deux ; l'assemblage du premier substrat et du second substrat avec les composants de dispositif électronique entre les substrats ; l'utilisation du laser pour diriger un faisceau laser sur la couche de contour de liaison intermédiaire avec un motif de balayage progressif prédéfini, de sorte que la couche de contour de liaison intermédiaire soit progressivement fondue et forme un joint, liant les substrats ensemble. De préférence, chaque passage laser linéaire chevauche longitudinalement les passages lasers linéaires précédent et suivant sur ledit contour. De préférence, chaque passage laser linéaire est suivi d'une piste de retour arrière partielle de chaque passage laser linéaire, de sorte qu'une partie du passage laser linéaire chevauche longitudinalement le passage laser linéaire précédent.
Also published as
Latest bibliographic data on file with the International Bureau