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1. (WO2017221218) LASER-ASSISTED HERMETIC ENCAPSULATION PROCESS AND PRODUCT THEREOF
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/221218 International Application No.: PCT/IB2017/053808
Publication Date: 28.12.2017 International Filing Date: 26.06.2017
IPC:
C03C 27/06 (2006.01) ,B23K 1/005 (2006.01) ,B29C 65/14 (2006.01) ,B29C 65/16 (2006.01) ,B29C 65/48 (2006.01) ,B23K 26/20 (2014.01) ,B23K 35/22 (2006.01) ,H01L 51/52 (2006.01) ,C03C 27/04 (2006.01) ,B23K 26/073 (2006.01) ,B23K 26/062 (2014.01) ,B23K 26/082 (2014.01)
C CHEMISTRY; METALLURGY
03
GLASS; MINERAL OR SLAG WOOL
C
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
27
Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
06
Joining glass to glass by processes other than fusing
[IPC code unknown for B23K 1/05]
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65
Joining of preformed parts; Apparatus therefor
02
by heating, with or without pressure
14
using wave energy or particle radiation
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65
Joining of preformed parts; Apparatus therefor
02
by heating, with or without pressure
14
using wave energy or particle radiation
16
Laser beam
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65
Joining of preformed parts; Apparatus therefor
48
using adhesives
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
20
Bonding, e.g. welding
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22
characterised by the composition or nature of the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52
Details of devices
C CHEMISTRY; METALLURGY
03
GLASS; MINERAL OR SLAG WOOL
C
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
27
Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
04
Joining glass to metal by means of an interlayer
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
02
Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06
Shaping the laser beam, e.g. by masks or multi-focusing
073
Shaping the laser spot
[IPC code unknown for B23K 26/062][IPC code unknown for B23K 26/082]
Applicants:
EFACEC ENGENHARIA E SISTEMAS, S.A. [PT/PT]; Rua Frederico Ulrich, Apartado 3078, Moreira Da Maia 4471-907 Guardeiras, PT
Inventors:
MAGALHÃES MENDES, Adélio Miguel; PT
MAGALHÃES MENDES, Joaquim Gabriel; PT
MADUREIRA ANDRADE, Luísa Manuela; PT
EMAMI, Seyedali; PT
SANTOS MARTINS, Jorge Filipe; PT
DOS SANTOS PINTO, Jorge Miguel; PT
Agent:
HUMBERTO FERREIRA, lUIS; PT
Priority Data:
10948925.06.2016PT
10982602.01.2017PT
Title (EN) LASER-ASSISTED HERMETIC ENCAPSULATION PROCESS AND PRODUCT THEREOF
(FR) PROCÉDÉ D'ENCAPSULATION HERMÉTIQUE ASSISTÉ PAR LASER ET PRODUIT ASSOCIÉ
Abstract:
(EN) Electronic device encapsulation process, assisted by a laser, for obtaining a sealed electronic device, wherein said process comprises: providing a first substrate and a second substrate, the second substrate being transparent in the emission wavelength of the laser, depositing an intermediate bonding contour layer on one or both of the substrates; depositing electronic device components on one or both of the substrates; joining the first substrate and second substrate with the electronic device components in-between the substrates; using the laser to direct a laser beam onto the intermediate bonding contour layer with a predefined progressive scan pattern, such that the intermediate bonding contour layer is progressively melted and forms a seal, bonding the substrates together. Preferably, each linear laser pass overlaps longitudinally the previous and the following linear laser passes along said contour. Preferably, each linear laser pass is followed by a partial backtrack of the each linear laser pass, such that a part of the linear laser pass overlaps longitudinally the previous linear laser pass.
(FR) La présente invention concerne un procédé d'encapsulation de dispositif électronique, assisté par laser, pour obtenir un dispositif électronique étanche, ledit procédé comprenant : la fourniture d'un premier substrat et d'un second substrat, le second substrat étant transparent dans la longueur d'onde d'émission du laser, le dépôt d'une couche de contour de liaison intermédiaire sur un substrat ou les deux, le dépôt des composants de dispositif électronique sur un substrat ou les deux ; l'assemblage du premier substrat et du second substrat avec les composants de dispositif électronique entre les substrats ; l'utilisation du laser pour diriger un faisceau laser sur la couche de contour de liaison intermédiaire avec un motif de balayage progressif prédéfini, de sorte que la couche de contour de liaison intermédiaire soit progressivement fondue et forme un joint, liant les substrats ensemble. De préférence, chaque passage laser linéaire chevauche longitudinalement les passages lasers linéaires précédent et suivant sur ledit contour. De préférence, chaque passage laser linéaire est suivi d'une piste de retour arrière partielle de chaque passage laser linéaire, de sorte qu'une partie du passage laser linéaire chevauche longitudinalement le passage laser linéaire précédent.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)