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1. (WO2017204553) FINE-WIRING FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/204553 International Application No.: PCT/KR2017/005402
Publication Date: 30.11.2017 International Filing Date: 24.05.2017
IPC:
H05K 3/40 (2006.01) ,H05K 3/28 (2006.01) ,H05K 1/03 (2006.01) ,H05K 3/18 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
40
Forming printed elements for providing electric connections to or between printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
18
using precipitation techniques to apply the conductive material
Applicants: FINE CHEM CO. LTD[KR/KR]; 12, Gaetbeol-ro Yeonsu-gu Incheon 21999, KR
Inventors: PARK, Kwang Soo; KR
Agent: GHONG-GAN INTERNATIONAL PATENT LAW FIRM; #402, (Yeoksam-dong Pyunghwa B/D) 412, Nonhyeon-ro Gangnam-gu Seoul 06224, KR
Priority Data:
10-2016-006522727.05.2016KR
Title (EN) FINE-WIRING FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
(FR) CARTE DE CIRCUIT IMPRIMÉE SOUPLE À CÂBLAGE FIN ET SON PROCÉDÉ DE FABRICATION
(KO) 미세배선용 연성 회로 기판 및 이의 제조방법
Abstract:
(EN) The present invention relates to a fine-wiring flexible circuit board for forming double-sided wiring on both a top part and a bottom part of an insulation layer of a flexible board, and a manufacturing method therefor.
(FR) La présente invention concerne une carte de circuit imprimé souple à câblage fin pour former un câblage double face à la fois sur une partie supérieure et une partie inférieure d'une couche isolante d'une carte souple, ainsi qu'un procédé de fabrication associé.
(KO) 본 발명은 연성 기판 절연층의 상부와 하부에 양면 배선형성을 위한 미세배선용 연성 회로 기판 및 이의 제조방법에 관한 것이다.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)