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1. (WO2017204462) POLYAMIDE-IMIDE, METHOD FOR PREPARING SAME, AND POLYAMIDE-IMIDE FILM USING SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2017/204462    International Application No.:    PCT/KR2017/003943
Publication Date: 30.11.2017 International Filing Date: 12.04.2017
IPC:
C08G 73/14 (2006.01), C08G 73/10 (2006.01), C08L 79/08 (2006.01), C08J 5/18 (2006.01)
Applicants: LG CHEM, LTD. [KR/KR]; 128 Yeoui-daero Yeongdeungpo-gu Seoul 07336 (KR)
Inventors: YUN, Cheolmin; (KR).
SUH, Jun Sik; (KR).
KIM, Kyungjun; (KR)
Agent: KIM, Aera; (KR)
Priority Data:
10-2016-0063317 24.05.2016 KR
Title (EN) POLYAMIDE-IMIDE, METHOD FOR PREPARING SAME, AND POLYAMIDE-IMIDE FILM USING SAME
(FR) POLYAMIDE-IMIDE, PROCÉDÉ DE PRÉPARATION DU POLYAMIDE-IMIDE, ET FILM DE POLYAMIDE-IMIDE UTILISANT LE POLYAMIDE-IMIDE
(KO) 폴리아미드이미드, 이의 제조방법 및 이를 이용한 폴리아미드이미드 필름
Abstract: front page image
(EN)The present invention provides polyamide-imide, a method for preparing same, and a polyamide-imide film using same. The polyamide-imide film exhibits excellent transparency, heat resistance, mechanical strength and flexibility, and thus may be used in various fields such as substrates for devices, cover substrates for displays, optical films, integrated circuit (IC) packages, adhesive films, multilayer flexible printed circuits (FRCs), tapes, touch panels and protective films for optical discs.
(FR)La présente invention concerne un polyamide-imide, un procédé de préparation du polyamide-imide, et un film de polyamide-imide utilisant le polyamide-imide. Le film de polyamide-imide fait preuve d’une transparence, d’une résistance à la chaleur, d’une résistance mécanique et d’une souplesse excellentes, et ainsi peut être utilisé dans divers domaines tels que les substrats pour dispositifs, les substrats de recouvrement pour les affichages, les films optiques, les emballages de circuits intégrés (CI), les films adhésifs, les circuits imprimés souples multicouches (FRC), les bandes, les panneaux tactiles et les films protecteurs pour disques optiques.
(KO)본 발명은 폴리아미드이미드, 이의 제조방법 및 이를 이용한 폴리아미드이미드 필름을 제공한다. 상기 폴리아미드이미드 필름은, 투명성, 내열성, 기계적 강도 및 유연성이 우수하여, 소자용 기판, 디스플레이이용 커버기판, 광학필름, IC(integrated circuit) 패키지, 전착필름(adhesive film), 다층 FRC(flexible printed circuit), 테이프, 터치패널, 광디스크용 보호필름 등과 같은 다양한 분야에 사용될 수 있다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)