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1. (WO2017204035) POLISHING SOLUTION, METHOD FOR PRODUCING POLISHING SOLUTION, POLISHING SOLUTION STOCK SOLUTION, AND CHEMOMECHANICAL POLISHING METHOD

Pub. No.:    WO/2017/204035    International Application No.:    PCT/JP2017/018353
Publication Date: Fri Dec 01 00:59:59 CET 2017 International Filing Date: Wed May 17 01:59:59 CEST 2017
IPC: C09K 3/14
B24B 37/00
C09G 1/02
H01L 21/304
Applicants: FUJIFILM CORPORATION
富士フイルム株式会社
Inventors: KAMIMURA Tetsuya
上村 哲也
Title: POLISHING SOLUTION, METHOD FOR PRODUCING POLISHING SOLUTION, POLISHING SOLUTION STOCK SOLUTION, AND CHEMOMECHANICAL POLISHING METHOD
Abstract:
The invention provides a polishing solution that can obtain an excellent polishing rate when applied to CMP and is less likely to cause dishing of the surface to be polished, a method for producing a polishing solution, a polishing solution stock solution, and a chemomechanical polishing method. This polishing solution is a polishing solution for chemomechanical polishing that contains colloidal silica, an amino acid, two or more azole compounds, and an oxidizing agent, wherein a reaction layer having a thickness of 1-20 nm and containing copper atoms is formed on a copper substrate when the polishing solution and a copper substrate are brought into contact for 24 hours.