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1. (WO2017203924) THERMALLY CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF
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Pub. No.: WO/2017/203924 International Application No.: PCT/JP2017/016458
Publication Date: 30.11.2017 International Filing Date: 26.04.2017
IPC:
C08L 83/07 (2006.01) ,C08K 3/22 (2006.01) ,C08K 3/28 (2006.01) ,C08L 83/05 (2006.01) ,C08L 83/06 (2006.01) ,C09K 5/10 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
07
containing silicon bound to unsaturated aliphatic groups
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
18
Oxygen-containing compounds, e.g. metal carbonyls
20
Oxides; Hydroxides
22
of metals
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
28
Nitrogen-containing compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
05
containing silicon bound to hydrogen
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
06
containing silicon bound to oxygen-containing groups
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
5
Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
08
Materials not undergoing a change of physical state when used
10
Liquid materials
Applicants:
信越化学工業株式会社 SHIN-ETSU CHEMICAL CO., LTD. [JP/JP]; 東京都千代田区大手町二丁目6番1号 6-1, Ohtemachi 2-chome, Chiyoda-ku, Tokyo 1000004, JP
Inventors:
伊藤 崇則 ITO Takanori; JP
Agent:
特許業務法人英明国際特許事務所 PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE; 東京都中央区銀座二丁目16番12号 銀座大塚ビル2階 GINZA OHTSUKA Bldg. 2F, 16-12, Ginza 2-chome, Chuo-ku, Tokyo 1040061, JP
Priority Data:
2016-10321624.05.2016JP
Title (EN) THERMALLY CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF
(FR) COMPOSITION DE SILICONE THERMIQUEMENT CONDUCTRICE ET SON PRODUIT DURCI
(JA) 熱伝導性シリコーン組成物及びその硬化物
Abstract:
(EN) A thermally conductive silicone composition having an organopolysiloxane as a base polymer and containing a thermally conductive filler, wherein the thermally conductive silicone composition that includes aluminum nitride having an average particle size of 10-100 μm and crushed alumina having an average particle size of 0.1-5 μm as a thermally conductive filler, contains 15-55 mass% of crushed alumina in the total amount of aluminum nitride and crushed alumina, and contains a total of 60-95 mass% of aluminum nitride and crushed alumina in the thermally conductive silicone composition has excellent moldability, high thermal conductivity and low thermal resistance, can give a cured product also having excellent water resistance, and has good adhesiveness during mounting when used as a heat-dissipating member.
(FR) La présente invention a trait à une composition de silicone thermiquement conductrice présentant un organopolysiloxane comme polymère de base et comportant une charge thermiquement conductrice, la composition de silicone thermiquement conductrice qui comprend du nitrure d’aluminium présentant une taille moyenne de particule de 10 à 100 µm et de l’alumine concassée présentant une taille moyenne de particule de 0,1 à 5 µm comme charge thermiquement conductrice, comportant de 15 à 55 % en masse d’alumine concassée en la quantité totale du nitrure d’aluminium et de l’alumine concassée, et comportant un total de 60 à 95 % en masse de nitrure d’aluminium et d’alumine concassée dans la composition de silicone thermiquement conductrice, présentant une excellente aptitude au moulage, une conductivité thermique élevée et une faible résistance thermique, pouvant fournir un produit durci présentant également une excellente résistance à l’eau, et présentant une bonne adhésivité pendant le montage lorsqu’elle est utilisée comme élément de dissipation thermique.
(JA) オルガノポリシロキサンをベースポリマーとし、熱伝導性充填材を含有してなる熱伝導性シリコーン組成物において、熱伝導性充填材として、平均粒径10~100μmの窒化アルミニウムと平均粒径0.1~5μmの破砕状アルミナとを含み、破砕状アルミナを窒化アルミニウムと破砕状アルミナとの合計量中15~55質量%含有すると共に、窒化アルミニウムと破砕状アルミナとを合計で熱伝導性シリコーン組成物中60~95質量%含有する熱伝導性シリコーン組成物は、成型性に優れ、高熱伝導かつ低熱抵抗であり、耐水性にも優れた硬化物となり得、放熱部材として用いた場合に実装時の密着性が良好なものである。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)