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1. (WO2017203622) SEALING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEALING MATERIAL
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2017/203622    International Application No.:    PCT/JP2016/065434
Publication Date: 30.11.2017 International Filing Date: 25.05.2016
IPC:
H01L 21/56 (2006.01), H01L 23/28 (2006.01), H01L 23/29 (2006.01), H01L 23/31 (2006.01)
Applicants: HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606 (JP)
Inventors: WATASE Yusuke; (JP).
FUJIMOTO Daisuke; (JP).
NOMURA Yutaka; (JP).
OGIHARA Hirokuni; (JP).
KANEKO Tomoyo; (JP).
SUZUKI Masahiko; (JP)
Agent: HASEGAWA Yoshiki; (JP)
Priority Data:
Title (EN) SEALING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEALING MATERIAL
(FR) STRUCTURE D'ÉTANCHÉITÉ, SON PROCÉDÉ DE FABRICATION, ET MATÉRIAU D'ÉTANCHÉITÉ
(JA) 封止構造体及びその製造方法、並びに、封止材
Abstract: front page image
(EN)Disclosed is a method for manufacturing a sealing structure, said method being provided with a sealing step for sealing an electronic component 10 by means of a resin layer 20a of a sealing material 1 that is provided with a metal layer 30, and the resin layer 20a disposed on the metal layer 30.
(FR)L'invention concerne un procédé de fabrication d'une structure d'étanchéité, ledit procédé comportant une étape d'étanchéification pour sceller un composant électronique 10 au moyen d’une couche de résine 20a d'un matériau d'étanchéité 1 qui est pourvu d'une couche métallique 30, et la couche de résine 20a étant disposée sur la couche métallique 30.
(JA) 金属層30と、金属層30上に配置された樹脂層20aと、を備える封止材1の樹脂層20aにより電子部品10を封止する封止工程を備える、封止構造体の製造方法。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)