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1. (WO2017203613) PROCESSING HEAD AND LASER PROCESSING MACHINE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/203613 International Application No.: PCT/JP2016/065364
Publication Date: 30.11.2017 International Filing Date: 24.05.2016
IPC:
B23K 26/046 (2014.01)
Applicants: MITSUBISHI ELECTRIC CORPORATION[JP/JP]; 7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008310, JP
Inventors: MIYAMOTO, Naoki; JP
NAGAI, Ryotaro; JP
SASAKI, Nozomu; JP
INOUE, Yoko; JP
SEGUCHI, Masaki; JP
Agent: TAKAMURA, Jun; JP
Priority Data:
Title (EN) PROCESSING HEAD AND LASER PROCESSING MACHINE
(FR) TÊTE DE TRAITEMENT ET MACHINE DE TRAITEMENT AU LASER
(JA) 加工ヘッド及びレーザ加工機
Abstract: front page image
(EN) A processing head (1) applies, to an object (W) to be processed, a laser beam (L) produced through oscillation by a laser oscillator (200). The processing head (1) is provided with a processing lens (20) that condenses the laser beam (L). The processing head (1) is provided with an optical component (40) that is arranged so as to be rotatable, around a rotation axis (41) intersecting with an axis (AX) parallel to an optical axis (P0) of the processing lens (20), between a protruding position (SL) through which the laser beam (L) that has been oscillated by the laser oscillator (200) and that is to enter the processing lens (20) passes, and a withdrawn position (EL) away from the laser beam (L).
(FR) Selon l'invention, une tête de traitement (1) applique, à un objet (W) à traiter, un faisceau laser (L) produit par oscillation par un oscillateur laser (200). La tête de traitement (1) est pourvue d'une lentille de traitement (20) qui condense le faisceau laser (L). La tête de traitement (1) est pourvue d'un composant optique (40) qui est agencé de manière à pouvoir tourner autour d'un axe de rotation (41) croisant un axe (AX) parallèle à un axe optique (P0) de la lentille de traitement (20), entre une position en saillie (SL) par laquelle passe le faisceau laser (L) dont l'oscillation est engendrée par l'oscillateur laser (200) et qui doit pénétrer dans la lentille de traitement (20), et une position retirée (EL) éloignée du faisceau laser (L).
(JA) 加工ヘッド(1)は、レーザ発振器(200)が発振したレーザビーム(L)を加工対象物(W)に照射する。加工ヘッド(1)は、レーザビーム(L)を集光する加工レンズ(20)を備える。加工ヘッド(1)は、レーザ発振器(200)により発振されかつ加工レンズ(20)に入射するレーザビーム(L)を通す突出位置(SL)と、レーザビーム(L)から離れる退避位置(EL)とに亘って、加工レンズ(20)の光軸(P0)と平行な軸線(AX)に交差する回転軸(41)を中心に回転自在に設けられた光学部品(40)を備える。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)