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1. (WO2017203607) INTERMEDIATE CONNECTOR, SEMICONDUCTOR DEVICE EQUIPPED WITH INTERMEDIATE CONNECTOR, AND METHOD FOR MANUFACTURING INTERMEDIATE CONNECTOR

Pub. No.:    WO/2017/203607    International Application No.:    PCT/JP2016/065338
Publication Date: Fri Dec 01 00:59:59 CET 2017 International Filing Date: Wed May 25 01:59:59 CEST 2016
IPC: H01L 23/12
H01L 23/32
H01R 11/01
H05K 1/02
Applicants: NODA SCREEN CO., LTD.
株式会社野田スクリーン
Inventors: OYAMADA Seisei
小山田 成聖
Title: INTERMEDIATE CONNECTOR, SEMICONDUCTOR DEVICE EQUIPPED WITH INTERMEDIATE CONNECTOR, AND METHOD FOR MANUFACTURING INTERMEDIATE CONNECTOR
Abstract:
An intermediate connector (1) is provided with: an elongated flat sheet-shaped power supply bus bar (11) connected to the power supply pads of a semiconductor integrated circuit (2); an elongated flat sheet-shaped ground bus bar (12) connected to the ground pads of the semiconductor integrated circuit; a thin film insulator layer (13) formed between the power supply bus bar (11) and the ground bus bar (12); and an elongated flat sheet-shaped electrically conductive path portion (14) which includes a plurality of electrically conductive paths (15) connected to the signal pads of the semiconductor integrated circuit. The power supply bus bar (11), the ground bus bar (12), and the electrically conductive path portion (14) are respectively disposed in a parallel arrangement corresponding to a parallel arrangement of a power supply pad row, a ground pad row, and a signal pad row of the semiconductor integrated circuit, in an erected state such that the longitudinal direction of the thin plates are in parallel with respect to a bump mounting surface (2S) of the semiconductor integrated circuit.