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1. (WO2017203464) SYSTEM FOR IMPRESSING A RELIEF PATTERN ON A SUBSTRATE

Pub. No.:    WO/2017/203464    International Application No.:    PCT/IB2017/053087
Publication Date: Fri Dec 01 00:59:59 CET 2017 International Filing Date: Fri May 26 01:59:59 CEST 2017
IPC: B30B 15/02
B31F 1/07
B31F 1/10
B31F 1/08
B44B 5/02
Applicants: HIGHCON SYSTEMS LTD.
Inventors: OR, Ron
KARP, Michael
ROTTMAN, Claudio
Title: SYSTEM FOR IMPRESSING A RELIEF PATTERN ON A SUBSTRATE
Abstract:
A die and counter die system for impressing a relief pattern onto a substrate, including at least one male die including a contact surface and defining a relief pattern, a compressible counter film including a base layer, a contact layer disposed opposite the contact surface of the at least one male die and spaced therefrom, and a compressible layer disposed between the base layer and the contact layer and attached thereto. The contact layer is featureless in a region thereof opposing the relief pattern on the at least one male die. The compressible counter film has a compressibility, in a direction perpendicular to a broad face of the compressible counter film, in the range of 5-30% at 1.35MPa. The system further includes a compression mechanism adapted to move the at least one male die and the compressible counter film towards one another in an operative mode.